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BSO080P03SHXUMA1 is listed in the Single FETs, MOSFETs range at ChipApex. The manufacturer field lists Infineon Technologies. Its product description is MOSFET P-CH 30V 12.6A 8DSO. Review the specifications below when checking this part for your BOM.
The BSO080P03SHXUMA1 is a P-Channel enhancement-mode power MOSFET from the OptiMOS™-P family, manufactured by Infineon Technologies. It features a PG-DSO-8 surface-mount package and operates within a temperature range of -55°C to +150°C. Key electrical parameters include a drain-source breakdown voltage (VDS) of -30 V, a continuous drain current (ID) of -14.9 A at 25°C, and a maximum on-state resistance (RDS(on)) of 8 mΩ at VGS = -10 V. The device exhibits a typical gate charge (QG) of 102 nC and supports a pulsed drain current of -60 A.
Verify the specific ordering suffix XUMA1 to confirm tape-and-reel packaging specifications. Ensure that the component meets all applicable JEDEC qualification standards required for the target application environment. Cross-reference the datasheet revision to confirm compatibility with existing design files.
Select this component when a low RDS(on) value is critical for minimizing conduction losses in high-current paths. The logic-level threshold allows for efficient driving without additional level-shifting circuitry. Evaluate the thermal resistance characteristics against the available PCB copper area to ensure adequate heat dissipation under steady-state conditions.
This part belongs to Infineon's OptiMOS™-P series, which focuses on optimizing the trade-off between on-resistance and gate charge for P-channel devices. The technology utilizes advanced silicon processes to achieve high performance in compact surface-mount packages suitable for automated assembly.
Direct substitutes must match the PG-DSO-8 footprint, -30 V rating, and comparable RDS(on). Verify pinout compatibility and thermal characteristics before implementation.
The absolute maximum rating for the gate-source voltage (VGS) is ±25 V.
The drain-source on-state resistance increases as the junction temperature rises, following the positive temperature coefficient characteristic of silicon MOSFETs.
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