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BSP125H6327XTSA1 is listed in the Single FETs, MOSFETs range at ChipApex. The manufacturer field lists Infineon Technologies. Its product description is MOSFET N-CH 600V 120MA SOT223-4. Review the specifications below when checking this part for your BOM.
The BSP125H6327XTSA1 is an N-Channel enhancement mode power MOSFET from Infineon's SIPMOS series, housed in a PG-SOT223-4 package. It features a drain-source breakdown voltage of 600 V and a continuous drain current of 0.12 A at 25°C. The device exhibits a typical on-state resistance of 25 Ω at VGS=10V and a gate threshold voltage of 1.9 V. Key dynamic characteristics include a total gate charge of 4.4 nC and a reverse diode dv/dt rating of 6 kV/µs. It operates within a junction temperature range of -55°C to +150°C and meets AEC-Q101 automotive qualification standards.
Verify the specific ordering suffix H6327 against official Infineon documentation to confirm packaging quantity and tape-and-reel specifications. Ensure the component meets RoHS compliance and halogen-free requirements as stated in the datasheet. Confirm that the PG-SOT223-4 footprint matches the target PCB design constraints before finalizing procurement orders.
Select this component for applications requiring high voltage blocking capability combined with low current handling in a compact surface-mount package. The logic-level gate drive simplifies interface design with standard microcontrollers. Consider the thermal resistance values when designing heat dissipation strategies for enclosed automotive enclosures or dense PCB layouts.
This part belongs to Infineon's SIPMOS family of power transistors, designed for general-purpose switching applications. The BSP125 variant specifically targets high-voltage scenarios within the SOT-223 form factor. It complements other devices in the lineup by offering enhanced dv/dt ratings suitable for demanding electrical environments found in modern vehicle electronics.
Consult official Infineon substitution guides for verified alternatives. Cross-reference pinout configurations and thermal characteristics carefully when evaluating potential replacements to ensure functional equivalence in existing circuit designs.
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