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The BSS138BKT-TP is an N-channel enhancement mode MOSFET manufactured by Micro Commercial Components (MCC). It features a Drain-Source Voltage (VDS) of 50V and a continuous Drain Current (ID) of 0.34A at 25°C, dropping to 0.27A at 70°C. The device has a maximum Gate-Source Voltage (VGS) of ±20V and operates within a junction temperature range of -55°C to +150°C. Electrical characteristics include a Drain-Source On-Resistance (RDS(on)) of 1.5Ω at VGS=10V/ID=0.3A, and a Gate Threshold Voltage (VGS(th)) ranging from 0.5V to 1.5V. Total power dissipation is rated at 0.35W.
Verify the component authenticity through authorized MCC distributors or direct procurement channels to avoid counterfeit parts. Confirm that the ordering suffix matches the specific tape and reel configuration required for automated assembly processes. Ensure compliance with RoHS directives and check for any recent product change notices regarding packaging or material composition updates before finalizing supply chain agreements.
Select this component when a small-signal N-channel MOSFET with 50V breakdown voltage is required in a compact SOT-523 package. Consider its low gate threshold voltage for compatibility with low-voltage logic drivers. Evaluate thermal performance based on the specified junction-to-ambient thermal resistance of 362°C/W for your specific PCB copper area and airflow conditions.
This part belongs to the BSS138 series of N-channel MOSFETs produced by Micro Commercial Components. It utilizes silicon gate technology and is designed for general-purpose switching applications. The device is housed in an SOT-523 surface-mount package, providing a compact footprint suitable for space-constrained electronic designs requiring efficient signal or power control.
Cross-reference with other manufacturers' BSS138 equivalents such as those from Diodes Incorporated or Rohm Semiconductor. Verify pinout compatibility and ensure electrical parameters like RDS(on) and VGS(th) meet circuit requirements. Note that while functional substitutes exist, verify package dimensions and thermal characteristics match the original design constraints.