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BTA140-600-0Q is listed in the Triacs range at ChipApex. The manufacturer field lists WeEn Semiconductors. Its product description is TRIAC 600V 25A TO220AB. Review the specifications below when checking this part for your BOM.
The WeEn Semiconductors BTA140-600-0Q is a planar passivated four-quadrant triac housed in a TO-220AB plastic package. It features a rated repetitive peak off-state voltage of 600 V and an RMS on-state current of 25 A. The device supports a non-repetitive surge current of 190 A and operates within a junction temperature range up to 125°C. Key electrical parameters include a maximum gate trigger current of 70 mA, a holding current of 60 mA, and a peak on-state voltage of 1.55 V. Designed for high bidirectional transient and blocking voltage capability, it ensures robust thermal cycling performance.
Verify the specific suffix against official manufacturer documentation to confirm exact pinout configuration and packaging variations. Ensure compatibility with existing thermal management designs given the TO-220AB form factor. Cross-reference datasheet revisions to validate parameter consistency before finalizing procurement specifications.
Select this component for applications requiring reliable AC power control with moderate current handling capabilities. The 600V rating suits standard mains voltage environments. Evaluate thermal dissipation requirements carefully as the 25A rating depends on adequate heatsinking. Confirm that the gate drive circuitry can supply the necessary trigger current for reliable turn-on across the operating temperature range.
This part belongs to the BTA140 series of general-purpose triacs from WeEn Semiconductors. The series is characterized by its robust construction suitable for industrial and consumer applications. It shares common design principles with other devices in the family, focusing on reliability and ease of integration into standard AC switching circuits.
Direct substitutes may include the BTA140-600 or BTA140-600G0Q. Verify equivalent electrical ratings and physical dimensions before substitution. Ensure any replacement maintains the same package type and thermal characteristics to fit existing board layouts without modification.
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