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The Nexperia BUK6D38-30EX is an N-channel enhancement mode Field-Effect Transistor utilizing Trench MOSFET technology. It is housed in a DFN2020MD-6 (SOT1220) surface-mount package with dimensions of 2 mm x 2 mm x 0.65 mm. Key electrical parameters include a drain-source voltage rating of 30 V, a continuous drain current of 17 A at 25 °C case temperature, and a maximum on-state resistance of 38 mΩ at VGS = 10 V. The device supports an extended junction temperature range up to 175 °C and features side wettable flanks for optical solder inspection.
Verify the specific suffix 'EX' against the manufacturer's official documentation to confirm packaging details such as reel specifications or tape-and-reel configurations. Ensure the component matches the DFN2020MD-6 package outline and that the marking code corresponds to the intended part number before integration into production designs.
Select this component for designs requiring low on-state resistance within a compact footprint. The 30 V rating and 17 A current capability suit standard automotive and industrial power switching tasks. Verify thermal management requirements given the 19 W dissipation limit and ensure gate drive voltages align with the specified threshold characteristics for optimal performance.
This device belongs to Nexperia's medium-power Trench MOSFET family designed for surface-mount applications. The DFN2020MD-6 package provides enhanced thermal performance compared to traditional plastic packages while maintaining a small board area. The product is engineered to meet rigorous automotive reliability standards, making it suitable for demanding environments.
Consult the official Nexperia replacement guide for verified cross-reference part numbers. Do not substitute based solely on pin compatibility; verify matching electrical ratings, package dimensions, and thermal characteristics to ensure circuit integrity.
The maximum junction temperature is 175 °C.
Yes, the DFN2020MD-6 package includes side wettable flanks specifically designed to allow optical inspection of solder joints.