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The BUK6D72-30EX is an N-channel enhancement mode Field-Effect Transistor utilizing Trench MOSFET technology, housed in a DFN2020MD-6 (SOT1220) plastic package. It features a drain-source voltage of 30 V and a continuous drain current of 11 A at 25 °C case temperature. The device supports an extended junction temperature range up to 175 °C and includes side wettable flanks for optical solder inspection. It is qualified to the AEC-Q101 standard for automotive applications.
Verify the specific ordering suffix against the manufacturer's official documentation to confirm exact packaging and reel specifications. Confirm that the component meets the required AEC-Q101 qualification standards for your target application environment. Ensure compatibility with the specified DFN2020MD-6 footprint during the design phase.
Select this component for designs requiring low on-state resistance and high thermal stability in compact spaces. The Trench MOSFET technology offers efficient switching performance suitable for power management tasks. Consider the 175 °C rating for environments with significant thermal constraints or high ambient temperatures.
This part belongs to Nexperia's portfolio of N-channel Trench MOSFETs designed for medium-power surface-mount applications. The DFN2020MD-6 package provides a small form factor with enhanced thermal dissipation capabilities compared to standard packages. It is engineered to meet rigorous automotive reliability standards while maintaining cost-effectiveness for mass production.
Check for direct substitutes within the same Nexperia family that share identical pinouts and electrical characteristics. Verify that any alternative component matches the 30 V rating and 11 A current capability. Ensure the replacement package type is compatible with existing PCB footprints and soldering profiles.
The maximum junction temperature is 175 °C.
Yes, it features side wettable flanks specifically designed for optical solder inspection.
Yes, the device is qualified to the AEC-Q101 standard for automotive applications.