BUK7M33-60EX

BUK7M33-60EX

$0.85
  • Description:MOSFET N-CH 60V 24A LFPAK33
  • Series:-
  • Mfr:Nexperia USA Inc.
  • Package:Tape & Reel (TR),Cut Tape (CT)

SKU:7ceed7118c4f Category: Brand:

  
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Product Detailed Parameters

  • Description:MOSFET N-CH 60V 24A LFPAK33
  • Series:-
  • Mfr:Nexperia USA Inc.
  • Package:Tape & Reel (TR),Cut Tape (CT)
  • FET Type:N-Channel
  • Technology:MOSFET (Metal Oxide)
  • Drain to Source Voltage (Vdss):60 V
  • Current - Continuous Drain (Id) @ 25°C:24A (Tc)
  • Drive Voltage (Max Rds On, Min Rds On):10V
  • Rds On (Max) @ Id, Vgs:33mOhm @ 5A, 10V
  • Vgs(th) (Max) @ Id:4V @ 1mA
  • Gate Charge (Qg) (Max) @ Vgs:10.9 nC @ 10 V
  • Vgs (Max):±20V
  • Input Capacitance (Ciss) (Max) @ Vds:628 pF @ 25 V
  • FET Feature:-
  • Power Dissipation (Max):44W (Tc)
  • Operating Temperature:-55°C ~ 175°C (TJ)
  • Grade:Automotive
  • Qualification:AEC-Q101
  • Mounting Type:Surface Mount
  • Supplier Device Package:LFPAK33
  • Package / Case:SOT-1210, 8-LFPAK33 (5-Lead)

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BUK7M33-60EX

Overview

The BUK7M33-60EX is a standard level N-channel MOSFET manufactured by Nexperia USA Inc., utilizing TrenchMOS technology within an LFPAK33 (SOT1210) surface-mount package. It features a drain-source voltage of 60 V and a continuous drain current of 24 A at 25 °C mounting base temperature. The device exhibits a maximum on-state resistance of 33 mΩ at VGS = 10 V and ID = 5 A. Total power dissipation reaches 44 W under specified thermal conditions, with a junction temperature range spanning from -55 °C to +175 °C.

Feature Summary

  • Qualified to AEC-Q101 automotive standards for high-performance applications
  • Rated for repetitive avalanche energy operation
  • Maintains true standard level gate threshold exceeding 1 V at elevated temperatures

Applications

  • 12 V automotive systems
  • Motor, lamp, and solenoid control circuits
  • Transmission control modules
  • Ultra-high performance power switching

Procurement Notes

Verify the specific ordering suffix against official Nexperia documentation to confirm tape-and-reel packaging specifications. Confirm that the component meets RoHS compliance requirements and check for any REACH SVHC declarations relevant to your manufacturing region before finalizing procurement orders.

Selection Notes

Select this component when designing circuits requiring robust automotive-grade reliability and high thermal stability up to 175 °C. The LFPAK33 package provides efficient heat dissipation suitable for demanding environments. Ensure gate drive voltages align with the standard level gate characteristics to optimize switching performance and minimize conduction losses.

Part Context

This part belongs to the BUK7M series of N-channel MOSFETs designed for automotive use. It employs TrenchMOS technology to achieve low on-resistance in a compact surface-mount footprint. The LFPAK33 package integrates a mounting base connected directly to the drain for superior thermal management compared to traditional plastic packages.

Replacement Considerations

Consult official Nexperia substitution guides for verified alternatives. Cross-reference pinout configurations and thermal resistance values when evaluating potential replacements to ensure compatibility with existing PCB layouts and cooling solutions.

BUK7M33-60EXBUK7M33-60EX
$0.85
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