BUK7Y19-100EX

$1.51

Description：MOSFET N-CH 100V LFPAK56-SO8
Series：-
Mfr：Nexperia USA Inc.
Package：Tape & Reel (TR),Cut Tape (CT)

SKU:358f4059e676 Category: Single FETs, MOSFETs Brand: Nexperia USA Inc.

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Product introduction

Product Detailed Parameters

Description：MOSFET N-CH 100V LFPAK56-SO8
Series：-
Mfr：Nexperia USA Inc.
Package：Tape & Reel (TR),Cut Tape (CT)
FET Type：N-Channel
Technology：MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss)：100 V
Current - Continuous Drain (Id) @ 25°C：56A (Tc)
Drive Voltage (Max Rds On, Min Rds On)：10V
Rds On (Max) @ Id, Vgs：-
Vgs(th) (Max) @ Id：-
Gate Charge (Qg) (Max) @ Vgs：-
Vgs (Max)：±20V
Input Capacitance (Ciss) (Max) @ Vds：-
FET Feature：-
Power Dissipation (Max)：169W (Tc)
Operating Temperature：-55°C ~ 175°C (TJ)
Grade：Automotive
Qualification：AEC-Q101
Mounting Type：Surface Mount
Supplier Device Package：LFPAK56, Power-SO8
Package / Case：SC-100, SOT-669

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BUK7Y19-100EX

Overview

The BUK7Y19-100EX is a standard level N-channel MOSFET utilizing TrenchMOS technology, housed in an LFPAK56 (Power SO8) package. It features a drain-source voltage of 100 V and a continuous drain current of 56 A at 25 °C mounting base temperature. The device exhibits a maximum on-state resistance of 19 mΩ at VGS = 10 V and ID = 15 A. Total power dissipation reaches 169 W under specified conditions. The component supports junction temperatures up to 175 °C and includes repetitive avalanche rating capabilities.

Feature Summary

Qualified to AEC-Q101 standards for high-performance automotive applications
Capable of handling thermally demanding environments with a 175 °C rating
Features true standard level gate drive compatibility with threshold voltage greater than 1 V at 175 °C
Includes repetitive avalanche rating for enhanced ruggedness

Applications

12 V, 24 V and 48 V Automotive systems
Motors, lamps and solenoid control
Transmission control
Ultra high performance power switching

Procurement Notes

Verify the specific ordering suffix against the manufacturer's official documentation to ensure correct packaging and marking codes. Confirm that the LFPAK56 package variant matches the required PCB footprint and thermal management strategy. Cross-reference the AEC-Q101 qualification status with project requirements before finalizing procurement decisions.

Selection Notes

Select this component for designs requiring robust automotive-grade reliability and high current handling within a compact surface-mount form factor. The standard level gate drive simplifies driver circuit design by eliminating the need for specialized high-voltage gate drivers. Ensure adequate thermal dissipation paths are designed to support the 175 °C junction temperature capability.

Part Context

This device belongs to Nexperia's TrenchMOS portfolio, engineered for efficiency and durability in critical electronic systems. The LFPAK56 package provides superior thermal performance compared to traditional plastic packages, facilitating effective heat transfer from the junction to the mounting base for sustained operation in high-power scenarios.