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Product Detailed Parameters
- Description：MOSFET N-CH 40V 120A LFPAK56
- Series：-
- Mfr：Nexperia USA Inc.
- Package：Tape & Reel (TR),Cut Tape (CT)
- FET Type：N-Channel
- Technology：MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss)：40 V
- Current - Continuous Drain (Id) @ 25°C：120A (Tc)
- Drive Voltage (Max Rds On, Min Rds On)：10V
- Rds On (Max) @ Id, Vgs：2.5mOhm @ 25A, 10V
- Vgs(th) (Max) @ Id：3.6V @ 1mA
- Gate Charge (Qg) (Max) @ Vgs：79 nC @ 10 V
- Vgs (Max)：+20V, -10V
- Input Capacitance (Ciss) (Max) @ Vds：4790 pF @ 25 V
- FET Feature：-
- Power Dissipation (Max)：190W (Tc)
- Operating Temperature：-55°C ~ 175°C (TJ)
- Grade：Automotive
- Qualification：AEC-Q101
- Mounting Type：Surface Mount
- Supplier Device Package：LFPAK56, Power-SO8
- Package / Case：SC-100, SOT-669
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Overview
The Nexperia BUK7Y2R5-40HX is an automotive qualified N-channel MOSFET utilizing Trench 9 low ohmic superjunction technology. It features a 40 V drain-source voltage rating and a continuous drain current of 120 A at 25 °C mounting base temperature. The device offers a maximum on-state resistance of 2.5 mΩ at VGS = 10 V and ID = 25 A. Total power dissipation reaches 190 W under specified conditions. The component operates within a junction temperature range of -55 °C to +175 °C and is housed in the LFPAK56 (SOT669) surface-mount package.
Feature Summary
- Fully automotive qualified to AEC-Q101 standards with a 175 °C thermal rating for demanding environments
- Trench 9 Superjunction technology provides enhanced power density, lower RDSon, and improved avalanche capability compared to standard TrenchMOS
- LFPAK copper clip technology reduces thermal resistance and increases maximum current capability through improved current spreading
- Gull Wing leads ensure high board level reliability by absorbing mechanical stress during thermal cycling
Applications
- 12 V automotive systems
- Motors, lamps and solenoid control
- Start-Stop micro-hybrid applications
- Transmission control
- Ultra high performance power switching
Procurement Notes
Verify the specific ordering suffix against the manufacturer's official documentation to confirm packaging details such as reel or cut tape configuration. Ensure the part number matches the exact electrical specifications required for the target application. Cross-reference the AEC-Q101 qualification status directly with the datasheet to confirm automotive grade compliance before finalizing procurement decisions.
Selection Notes
Select this component when designing circuits requiring robust automotive-grade N-channel switching with low conduction losses. The LFPAK56 package is suitable for applications needing efficient heat dissipation via the mounting base. Consider the tight VGS(th) limits if paralleling multiple devices is necessary for higher current handling. Evaluate the thermal resistance characteristics against the PCB layout to ensure operation within the 175 °C junction temperature limit.
Part Context
This device belongs to the Nexperia BUK7Y series of automotive MOSFETs. It utilizes the SOT669 (LFPAK56) plastic single-ended surface-mounted package variant. The product is designed for high-performance power switching in thermally constrained automotive environments, leveraging advanced superjunction architecture to optimize efficiency within a compact footprint.
Replacement Considerations
Consult the official Nexperia replacement guide for verified substitutes. Direct replacements must maintain equivalent voltage, current, and thermal ratings while adhering to the same package constraints.
