BUK7Y3R1-80MX

Overview

The BUK7Y3R1-80M is an automotive qualified N-channel MOSFET utilizing Trench 14 split-gate technology for ultra-low RDSon. It operates with a drain-source voltage of 80 V and supports a continuous drain current of 160 A at 25 °C. The device features a maximum on-state resistance of 3.1 mΩ and total power dissipation of 254 W. Junction temperature ranges from -55 °C to 175 °C, with a gate-source voltage limit of ±20 V.

Feature Summary

• Fully automotive qualified to AEC-Q101 standards for high performance and endurance in thermally demanding environments.
• Trench 14 split-gate technology reduces cell pitch to enhance power density and efficiency while maintaining low switching spiking.
• LFPAK Gull Wing leads absorb mechanical stress during thermal cycling and enable visual AOI soldering inspection without x-ray equipment.
• LFPAK copper clip technology improves reliability by reducing thermal resistance, on-state resistance, and package inductance.

Applications

• 12 V, 24 V and 48 V automotive systems
• Motor, lighting and solenoid control
• Ultra high-performance power switching

Procurement Notes

Verify the specific ordering suffix 'MX' against official Nexperia documentation to confirm reel specifications or tape-and-reel dimensions, as datasheets may list standard packaging variants. Confirm that the component status remains in production rather than development or preliminary phases before finalizing supply chain agreements.

Selection Notes

Select this component when designing circuits requiring automotive-grade reliability combined with minimal conduction losses. The LFPAK56 package offers superior board-level reliability compared to traditional QFNs due to gull-wing lead flexibility. Ensure PCB thermal design accommodates the 254 W dissipation rating to maintain junction temperatures within the specified -55 °C to 175 °C range.

Part Context

This device belongs to the Nexperia BUK7Y series, which employs advanced Trench 14 technology to deliver industry-leading power density. The series targets high-efficiency power management solutions where space constraints and thermal performance are critical. The LFPAK56 package provides a compact footprint suitable for dense automotive PCB layouts.

Replacement Considerations

Direct substitutes include other BUK7Y series devices with compatible voltage and current ratings, such as the BUK7Y3R1-80EX or BUK7Y41-80EX, provided they match the LFPAK56 (SOT669) footprint and pinout configuration.

FAQ

What is the peak pulsed drain current capability?

The peak drain current (IDM) is 754 A for pulses up to 10 µs at a mounting base temperature of 25 °C.

How does the LFPAK56 package improve reliability?

The LFPAK56 package uses copper clip technology to reduce thermal resistance and package inductance, while the gull-wing leads absorb mechanical stress during thermal cycling better than traditional QFN packages.