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The BUK9507-30B,127 is an N-channel enhancement mode power transistor manufactured by Nexperia using Philips High-Performance Automotive (HPA) TrenchMOS technology. It is housed in a SOT78 (TO-220AB) plastic package with the mounting base connected to the drain. Key electrical parameters include a drain-source voltage of 30 V, a continuous drain current of 75 A at 25 °C, and a typical on-state resistance of 5.9 mΩ. The device supports a total power dissipation of 157 W and operates within a junction temperature range of -55 °C to +175 °C.
Verify component authenticity through authorized Nexperia distributors or certified supply chain partners. Confirm that the received part matches the specific SOT78 package outline and marking codes defined in the official datasheet. Ensure storage conditions adhere to moisture sensitivity levels to prevent damage prior to soldering. Review the most recent product data sheet for any updates regarding availability or specification changes before finalizing procurement orders.
Select this component for designs requiring robust automotive-grade reliability and high current handling capabilities. The logic level gate drive compatibility simplifies interface requirements with standard control circuits. Consider the thermal management needs associated with the TO-220AB package when designing heat sinks. Verify that the 30 V drain-source voltage rating aligns with the maximum operating voltages of the target application circuit.
This device belongs to the BUK95/9607 series of N-channel TrenchMOS logic level FETs. It shares technical similarities with the BUK9607-30B, which utilizes a surface-mount D2-PAK package instead of the through-hole TO-220AB configuration. Both variants are designed for automotive applications and feature comparable electrical characteristics derived from the same underlying semiconductor technology.
The BUK9607-30B serves as a direct functional equivalent with identical electrical specifications but differs in package type (SOT404/D2-PAK). Designers must account for mechanical footprint differences and thermal dissipation variations when substituting between these package styles.
No, the mounting base is internally connected to the drain terminal.
The device can withstand a non-repetitive drain-source avalanche energy of 327 mJ under specified test conditions.