BUK964R7-80E,118

$3.79

Description：MOSFET N-CH 80V 120A D2PAK
Series：TrenchMOS™
Mfr：Nexperia USA Inc.
Package：Tape & Reel (TR),Cut Tape (CT)

SKU:cd4e2f53303a Category: Single FETs, MOSFETs Brand: Nexperia USA Inc.

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Product introduction

Product Detailed Parameters

Description：MOSFET N-CH 80V 120A D2PAK
Series：TrenchMOS™
Mfr：Nexperia USA Inc.
Package：Tape & Reel (TR),Cut Tape (CT)
FET Type：N-Channel
Technology：MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss)：80 V
Current - Continuous Drain (Id) @ 25°C：120A (Tc)
Drive Voltage (Max Rds On, Min Rds On)：5V
Rds On (Max) @ Id, Vgs：4.5mOhm @ 25A, 10V
Vgs(th) (Max) @ Id：2.1V @ 1mA
Gate Charge (Qg) (Max) @ Vgs：92.1 nC @ 5 V
Vgs (Max)：±10V
Input Capacitance (Ciss) (Max) @ Vds：15340 pF @ 25 V
FET Feature：-
Power Dissipation (Max)：324W (Tc)
Operating Temperature：-55°C ~ 175°C (TJ)
Grade：Automotive
Qualification：AEC-Q101
Mounting Type：Surface Mount
Supplier Device Package：D2PAK
Package / Case：TO-263-3, D2PAK (2 Leads + Tab), TO-263AB

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BUK964R7-80E,118

Overview

The BUK964R7-80E is an N-channel TrenchMOS logic level FET in a D2PAK (SOT404) package. It features a drain-source voltage of 80 V and a continuous drain current of 120 A at 25 °C mounting base temperature. The device has a maximum on-state resistance of 4.7 mΩ at VGS = 5 V and ID = 25 A. Total power dissipation reaches 324 W under specified conditions. It supports junction temperatures up to 175 °C and includes repetitive avalanche rating capabilities.

Feature Summary

AEC-Q101 compliant for automotive applications
Repetitive avalanche rated for robustness
Suitable for thermally demanding environments with 175 °C rating
True logic level gate operation

Applications

12V, 24V and 48V Automotive systems
Motors, lamps and solenoid control
Start-Stop micro-hybrid applications
Transmission control
Ultra high performance power switching

Procurement Notes

Verify the specific ordering suffix matches the required packaging configuration before procurement. Confirm that the component meets the necessary AEC-Q101 qualification standards for the intended automotive application environment. Ensure thermal management designs account for the specified junction-to-mounting base thermal resistance values provided in the datasheet.

Selection Notes

Select this component when low gate drive voltage compatibility is required alongside high current handling capabilities. The logic level gate threshold ensures efficient switching with standard logic drivers. Consider the D2PAK package size for PCB space constraints and verify that the mounting base thermal interface can support the required heat dissipation levels for the specific duty cycle.

Part Context

This part belongs to Nexperia's TrenchMOS family, utilizing advanced trench technology to achieve low on-state resistance. The SOT404 package provides a single-ended surface-mounted solution with a dedicated mounting base connected to the drain for improved thermal performance compared to standard leaded packages.