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Product Detailed Parameters
- Description：MOSFET N-CH 40V 50A LFPAK33
- Series：-
- Mfr：Nexperia USA Inc.
- Package：Tape & Reel (TR),Cut Tape (CT)
- FET Type：N-Channel
- Technology：MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss)：40 V
- Current - Continuous Drain (Id) @ 25°C：50A (Tc)
- Drive Voltage (Max Rds On, Min Rds On)：4.5V, 10V
- Rds On (Max) @ Id, Vgs：6mOhm @ 20A, 10V
- Vgs(th) (Max) @ Id：2.15V @ 1mA
- Gate Charge (Qg) (Max) @ Vgs：36 nC @ 10 V
- Vgs (Max)：+16V, -10V
- Input Capacitance (Ciss) (Max) @ Vds：2470 pF @ 25 V
- FET Feature：-
- Power Dissipation (Max)：70W (Tc)
- Operating Temperature：-55°C ~ 175°C (TJ)
- Grade：Automotive
- Qualification：AEC-Q101
- Mounting Type：Surface Mount
- Supplier Device Package：LFPAK33
- Package / Case：SOT-1210, 8-LFPAK33 (5-Lead)
Download product information
Overview
The Nexperia BUK9M6R0-40HX is an automotive qualified logic level N-channel MOSFET utilizing Trench 9 superjunction technology within an LFPAK33 (SOT1210) package. It features a drain-source voltage of 40 V and a continuous drain current of 50 A at 25 °C mounting base temperature. The device exhibits a maximum on-state resistance of 6 mΩ at VGS = 10 V and ID = 20 A. Total power dissipation reaches 70 W under specified conditions, with a junction temperature range spanning from -55 °C to +175 °C.
Feature Summary
- Fully automotive qualified to AEC-Q101 standards for high performance applications
- Trench 9 superjunction technology enables low power losses and high power density
- LFPAK copper clip package design ensures high robustness and reliability
- Repetitive avalanche rated for enhanced circuit protection
Applications
- 12 V automotive systems
- Powertrain, chassis, body and infotainment applications
- Medium/Low power motor drive
- DC-DC systems
- LED lighting
Procurement Notes
Verify the specific suffix 'HX' against official Nexperia documentation to confirm reel packaging specifications and tape-and-reel dimensions. Ensure the ordered part matches the SOT1210 package outline and marking code 96H040. Confirm compliance with RoHS and REACH requirements as stated in the product data sheet before integration into production lines.
Selection Notes
Select this component for designs requiring logic level gate drive compatibility with low threshold voltages. The LFPAK33 package offers a compact footprint suitable for space-constrained PCB layouts. Consider the thermal resistance characteristics and mounting base temperature limits when designing heat dissipation strategies for high-current operation scenarios.
Part Context
This device belongs to the Nexperia BUK9 series of automotive-grade power MOSFETs. It employs Trench 9 technology to achieve superior performance metrics compared to previous generations. The LFPAK33 package provides efficient thermal management through direct connection to the mounting base, facilitating reliable operation in demanding automotive environments.
Replacement Considerations
Consult official Nexperia substitution guides for verified alternatives. Cross-reference pinouts, package dimensions, and electrical parameters such as RDS(on) and VDS to ensure functional equivalence without modifying existing PCB footprints or thermal designs.
