BUK9Y2R8-40HX

$0.41

Description：BUK9Y2R8-40H/SOT669/LFPAK
Series：-
Mfr：Nexperia USA Inc.
Package：Tape & Reel (TR)

SKU:ef91b245ca38 Category: Single FETs, MOSFETs Brand: Nexperia USA Inc.

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Product introduction

Product Detailed Parameters

Description：BUK9Y2R8-40H/SOT669/LFPAK
Series：-
Mfr：Nexperia USA Inc.
Package：Tape & Reel (TR)
FET Type：-
Technology：-
Drain to Source Voltage (Vdss)：-
Current - Continuous Drain (Id) @ 25°C：120A (Tc)
Drive Voltage (Max Rds On, Min Rds On)：-
Rds On (Max) @ Id, Vgs：-
Vgs(th) (Max) @ Id：-
Gate Charge (Qg) (Max) @ Vgs：-
Vgs (Max)：+16V, -10V
Input Capacitance (Ciss) (Max) @ Vds：-
FET Feature：-
Power Dissipation (Max)：172W (Tc)
Operating Temperature：-
Grade：Automotive
Qualification：AEC-Q101
Mounting Type：-
Supplier Device Package：-
Package / Case：-

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BUK9Y2R8-40HX

Overview

The BUK9Y2R8-40HX is an automotive qualified N-channel MOSFET utilizing Trench 9 low ohmic superjunction technology. It features a 40 V drain-source voltage and a maximum continuous drain current of 120 A at 25 °C mounting base temperature. The device exhibits a typical on-state resistance of 2.8 mΩ at VGS = 10 V and ID = 25 A. Total power dissipation reaches 172 W under specified conditions. The component operates within a junction temperature range of -55 °C to +175 °C and is housed in an LFPAK56 (SOT669) package.

Feature Summary

Fully automotive qualified to AEC-Q101 standards for high performance and endurance.
Trench 9 Superjunction technology provides enhanced power density, lower RDS(on), and improved safe operating area compared to standard TrenchMOS.
LFPAK Gull Wing leads absorb mechanical stress during thermal cycling and enable visual AOI soldering inspection without x-ray equipment.
LFPAK copper clip technology reduces thermal resistance and increases maximum current capability.

Applications

12 V automotive systems
Motors, lamps and solenoid control
Start-Stop micro-hybrid applications
Transmission control
Ultra high performance power switching

Procurement Notes

Verify the specific ordering suffix against the manufacturer's official documentation to confirm packaging details such as reel or cut tape configuration. Ensure the part number matches the exact electrical specifications required for the target application. Cross-reference the AEC-Q101 qualification status with current product data sheets to confirm availability and compliance with automotive reliability standards before finalizing procurement decisions.

Selection Notes

Select this component for designs requiring robust automotive-grade reliability and high current handling in a compact footprint. The logic level gate drive capability allows compatibility with standard control interfaces. Consider the thermal management requirements associated with the LFPAK56 package to ensure the junction temperature remains within the specified operational limits during peak load conditions.

Part Context

This device belongs to Nexperia's BUK9Y series of automotive MOSFETs. It utilizes advanced Trench 9 superjunction technology to achieve low on-state resistance within the LFPAK56 package. The series is designed specifically for demanding automotive environments, offering improved avalanche capability and thermal performance compared to previous generation trench technologies.

Replacement Considerations

Direct substitutes include other Nexperia parts from the BUK9Y series with similar voltage and current ratings, such as the BUK9Y1R8-40H or BUK9Y3R8-40H, provided pinout and package compatibility are verified. Always consult the latest datasheets to confirm electrical parameter equivalence and package dimensions before substitution.