BUK9Y8R8-60ELX

$2.37

Description：SINGLE N-CHANNEL 60 V, 5.6 MOHM
Series：-
Mfr：Nexperia USA Inc.
Package：Tape & Reel (TR),Cut Tape (CT)

SKU:a29391690ea1 Category: Single FETs, MOSFETs Brand: Nexperia USA Inc.

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Product introduction

Product Detailed Parameters

Description：SINGLE N-CHANNEL 60 V, 5.6 MOHM
Series：-
Mfr：Nexperia USA Inc.
Package：Tape & Reel (TR),Cut Tape (CT)
FET Type：N-Channel
Technology：MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss)：60 V
Current - Continuous Drain (Id) @ 25°C：110A (Tc)
Drive Voltage (Max Rds On, Min Rds On)：4.5V, 10V
Rds On (Max) @ Id, Vgs：5.6mOhm @ 25A, 10V
Vgs(th) (Max) @ Id：2.1V @ 1mA
Gate Charge (Qg) (Max) @ Vgs：123 nC @ 10 V
Vgs (Max)：±10V
Input Capacitance (Ciss) (Max) @ Vds：6695 pF @ 25 V
FET Feature：-
Power Dissipation (Max)：194W (Tc)
Operating Temperature：-55°C ~ 175°C (TJ)
Grade：Automotive
Qualification：AEC-Q101
Mounting Type：Surface Mount
Supplier Device Package：LFPAK56, Power-SO8
Package / Case：SC-100, SOT-669

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BUK9Y8R8-60ELX

Overview

The BUK9Y8R8-60EL is a single N-channel logic level MOSFET from Nexperia, housed in an LFPAK56 (SOT669) package. It features Enhanced SOA technology and is qualified to AEC-Q101 standards for automotive use. Key electrical parameters include a drain-source voltage of 60 V and a maximum continuous drain current of 110 A at 25 °C mounting base temperature. The typical on-state resistance is 5.6 mΩ at VGS = 10 V and ID = 25 A. Total power dissipation reaches 194 W under specified conditions.

Feature Summary

Fully automotive qualified to AEC-Q101 standard with operation up to 175 °C junction temperature.
Enhanced SOA technology provides improved linear mode performance for robust operation.
LFPAK copper clip package ensures high robustness, superior current handling, and exceptional board-level reliability.

Applications

12 V automotive systems
Airbag squib voltage regulator MOSFET

Procurement Notes

Verify the specific ordering code against the manufacturer's latest documentation to ensure correct package variant and marking. Confirm that the application design accounts for thermal limitations imposed by PCB layout and operating temperatures, as continuous current ratings are dependent on these external factors rather than device limits alone.

Selection Notes

Select this component for applications requiring high current handling in a compact surface-mount footprint. The logic level gate drive capability allows compatibility with standard control interfaces. Ensure the design supports the required thermal management, as performance is heavily influenced by mounting base temperature and PCB copper area.

Part Context

This device belongs to Nexperia's portfolio of automotive-grade power MOSFETs designed for high-reliability environments. The LFPAK56 package offers a balance between thermal performance and mechanical stability, utilizing copper clip technology to minimize resistance and enhance heat dissipation compared to traditional plastic packages.

Replacement Considerations

No public confirmed substitute part numbers are documented in the provided datasheet. Cross-reference with other Nexperia LFPAK56 devices only if pinout and electrical specifications match exactly.