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The BYG10M-E3/TR3 is a standard avalanche SMD rectifier manufactured by Vishay General Semiconductor. It features a glass passivated pellet chip junction and operates in the SMA (DO-214AC) package. Key electrical parameters include a maximum repetitive peak reverse voltage of 1000 V, an average forward current of 1.5 A, and a peak forward surge current of 30 A. The device exhibits a maximum instantaneous forward voltage of 1.15 V at 1.5 A, a maximum DC reverse current of 1 µA at 25 °C, and a maximum reverse recovery time of 4 µs. It supports an operating junction temperature range from -55 to +150 °C.
Verify the specific ordering suffix against the manufacturer's documentation to confirm compliance status and packaging format. The base part number indicates RoHS compliance and commercial grade availability. Confirm whether the required quantity matches the standard delivery mode specifications provided in the datasheet. Ensure that any automotive qualification requirements are met by selecting the appropriate HE3 or HM3 variants if necessary.
Select this component when a high-voltage rectifier with controlled avalanche capability is required in a surface-mount configuration. The 1000 V rating suits applications involving significant reverse voltage stress. Consider the thermal resistance values relative to the expected ambient temperature and mounting conditions. Verify that the 4 µs reverse recovery time meets the switching speed requirements of the target circuit design.
This device belongs to the BYG10 series of standard avalanche SMD rectifiers offered by Vishay. The series includes multiple voltage ratings ranging from 200 V to 1600 V within the same DO-214AC package footprint. The E3 suffix denotes RoHS compliance and halogen-free construction for the commercial grade version. The TR3 suffix specifies the tape and reel packaging format used for automated assembly.
Cross-reference other BYG10 series parts such as BYG10D, BYG10G, BYG10J, BYG10K, or BYG10Y if different voltage ratings are needed while maintaining the same package and current capabilities.