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The BYG20J R3G is a high-efficiency recovery rectifier manufactured by Taiwan Semiconductor. It features a single-phase, single-element silicon construction housed in the DO-214AC (SMA) surface-mount package. The device supports a maximum repetitive reverse voltage of 600V and an average forward rectified current of 1.5A. Key electrical characteristics include a fast switching time of 75ns, a maximum non-repetitive peak forward surge current of 30A, and a low forward voltage drop of 1.4V at rated conditions. It operates within a temperature range of -55°C to +150°C junction temperature.
Verify the specific suffix 'R3G' against the manufacturer's latest datasheet to confirm packaging details and compliance status. Ensure the component matches the required DO-214AC footprint and pin configuration for your PCB layout. Cross-reference with official Taiwan Semiconductor documentation to validate availability and lead times before finalizing procurement plans.
Select this component when a 600V reverse voltage rating and 1.5A continuous current are required in a compact SMA package. The 75ns recovery time makes it suitable for higher frequency applications compared to standard rectifiers. Consider the 1.4V forward voltage drop for thermal management calculations in dense circuit designs.
This part belongs to the BYG20 series of high-efficient surface mount rectifiers from Taiwan Semiconductor. The series includes variants with different voltage ratings such as 200V, 400V, and 600V options. These devices share common mechanical dimensions and feature glass passivation for enhanced durability in demanding electronic environments.
Direct substitutes may include other 1.5A 600V SMA rectifiers with similar recovery times. Verify compatibility with equivalent parts like the ES1J or similar series if faster switching is acceptable. Always check pinout alignment and thermal characteristics before substituting.