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The BYG22D-M3/TR3 is an ultrafast avalanche SMD rectifier manufactured by Vishay General Semiconductor. It features a glass passivated pellet chip junction and operates in the SMA (DO-214AC) package. Key electrical parameters include a maximum repetitive peak reverse voltage of 200 V, an average forward current of 2.0 A, and a peak forward surge current of 35 A. The device exhibits a maximum instantaneous forward voltage of 1.1 V at 2.0 A, a maximum reverse current of 1.0 µA at 25 °C, and an ultra-fast reverse recovery time of 25 ns. It supports a pulse energy rating of 20 mJ in avalanche mode and functions within a temperature range of -55 to +150 °C.
Verify that the ordering suffix matches the required delivery mode and base quantity specifications. Confirm compliance requirements such as halogen-free status and RoHS directives based on the specific variant selected. Ensure the component meets the necessary automotive qualification standards if intended for AEC-Q101 applications. Cross-reference part numbers carefully to distinguish between commercial grade and qualified variants.
Select this component for designs requiring fast switching speeds and avalanche ruggedness in a compact surface mount form factor. Evaluate thermal resistance values relative to the expected ambient temperature and mounting conditions. Consider the low reverse leakage current and forward voltage drop for efficiency optimization in high-frequency converter topologies.
This device belongs to the BYG22 series of ultrafast avalanche rectifiers from Vishay General Semiconductor. The series includes variants with different voltage ratings, specifically 50 V, 100 V, and 200 V options. All members share similar physical dimensions and electrical characteristics regarding current handling and recovery speed, differing primarily in their maximum repetitive peak reverse voltage capabilities.
Direct substitutes within the same family include BYG22A-M3/TR3 and BYG22B-M3/TR3, which offer lower voltage ratings of 50 V and 100 V respectively while maintaining identical package and current specifications.