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The BYG23M is a high-efficiency surface mount rectifier manufactured by Taiwan Semiconductor. It features a glass passivated chip junction and is housed in a DO-214AC (SMA) package. The device supports a repetitive peak reverse voltage of 1000 V and an average forward current of 1.5 A. Key electrical parameters include a maximum forward voltage of 1.7 V at 1 A, a reverse recovery time of 65 ns, and a peak forward surge current capability of 50 A. The component operates within a junction temperature range of -55 to +150 °C.
Verify the specific ordering code against the manufacturer's official documentation to ensure correct packaging quantities and tape-and-reel specifications. Confirm that the requested variant matches the required RoHS compliance and halogen-free status as defined in the datasheet. Cross-reference the marking code and date code requirements with your assembly specifications before finalizing procurement orders.
Select this component when designing circuits requiring fast recovery times and high avalanche energy ratings. The DO-214AC package is suitable for space-constrained surface mount layouts. Ensure the operating environment stays within the specified thermal limits and that the reverse voltage rating exceeds the peak circuit voltages to maintain safe operation margins.
This part belongs to the BYG series of high-efficient surface mount rectifiers from Taiwan Semiconductor. It utilizes a glass passivation process to improve junction stability compared to standard epoxy encapsulated devices. The SMA footprint provides a compact solution for general-purpose rectification where faster switching speeds are preferred over standard recovery diodes.
Direct substitutes must match the 1000V/1.5A rating and DO-214AC package. Verify equivalent reverse recovery times and avalanche capabilities if used in snubber or free-wheeling roles.