BYG23MHM3_A/H

Overview

The BYG23MHM3_A/H is an ultrafast avalanche rectifier manufactured by Vishay General Semiconductor. It features a glass passivated pellet chip junction and operates in a single circuit configuration within the SMA (DO-214AC) surface-mount package. The device supports a maximum repetitive peak reverse voltage of 1000 V and an average forward current of 1.5 A at 65 °C. Key electrical characteristics include a maximum instantaneous forward voltage of 1.7 V, a peak forward surge current of 30 A, and a maximum reverse recovery time of 75 ns. It is rated for an operating junction temperature range from -55 to +150 °C.

Feature Summary

• Ultrafast reverse recovery performance suitable for high-frequency applications
• Avalanche-rated capability for energy dissipation in inductive switching loads
• Glass passivated junction providing robust protection against voltage transients

Applications

• High frequency rectification in switching mode converters
• Freewheeling diode applications in inverters
• Automotive electronic systems requiring AEC-Q101 qualification

Procurement Notes

Verify that the specific ordering code includes the HM3 suffix to confirm halogen-free compliance and RoHS adherence. Ensure the A/H revision codes match the required manufacturing date codes and quality standards. Confirm AEC-Q101 automotive qualification status if the application demands it, as this variant carries specific reliability testing requirements distinct from commercial grades.

Selection Notes

Select this component when designing circuits requiring high-voltage blocking capabilities combined with fast switching speeds. The avalanche rating makes it appropriate for environments where inductive kickback occurs during load switching. Verify thermal management strategies align with the specified junction-to-case thermal resistance values to maintain safe operating temperatures under continuous load conditions.

Part Context

This device belongs to the BYG23M series of ultrafast SMD rectifiers designed for compact electronics. The SMA package allows for automated placement and low-profile mounting on printed circuit boards. The product line emphasizes reliability through glass passivation and meets stringent material categorization guidelines for environmental compliance.

Replacement Considerations

Cross-reference with BYG23MHE3_A/H for non-halogenated alternatives or BYG23M-M3/TR for standard commercial grade equivalents. Ensure pinout compatibility and verify that replacement parts meet the same avalanche energy ratings and reverse recovery time specifications.