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The BYV15-TAP is a silicon avalanche rectifier diode manufactured by Vishay General Semiconductor - Diodes Division. It features an 800 V maximum DC reverse voltage and a 1.5 A average forward current rating. The device utilizes a SOD-57 axial through-hole package with a glass passivated junction. Key electrical characteristics include a 300 ns maximum reverse recovery time and a low reverse leakage current of 5 µA at the rated voltage. Designed for high reliability, it supports a maximum operating junction temperature of 175 °C.
Verify the specific suffix 'TAP' against the official Vishay datasheet to confirm packaging configuration, as standard part numbers may vary by reel or tube specifications. Ensure the component meets RoHS compliance requirements if mandated by the target assembly process. Cross-reference the manufacturer part number with authorized distributors to confirm current production status and availability lead times prior to finalizing procurement plans.
Select this component when circuit design requires an 800 V blocking capability combined with a 1.5 A continuous current handling capacity. The SOD-57 through-hole package is appropriate for designs prioritizing mechanical robustness over surface-mount density. Consider the 300 ns reverse recovery time for applications where moderate switching speeds are acceptable, avoiding ultra-fast alternatives unless necessary for efficiency optimization.
This component belongs to the Vishay BYV15 series of high-voltage silicon rectifiers. The series offers various voltage ratings from 50 V to 1000 V within the same physical footprint, allowing designers to scale voltage capabilities while maintaining consistent board layout dimensions. The avalanche-rated variants provide enhanced durability compared to standard rectifiers in inductive environments.
Consult the Vishay official documentation for qualified cross-references. Generic replacements must match the 800 V reverse voltage, 1.5 A current rating, SOD-57 package, and avalanche capability. Verify that substitute components meet the same reverse recovery time and thermal performance specifications.