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BYVB32-150-E3/81 is listed in the Diode Arrays range at ChipApex. The manufacturer field lists Vishay General Semiconductor - Diodes Division. Its product description is DIODE ARRAY GP 150V 18A TO263AB. Review the specifications below when checking this part for your BOM.
The BYVB32-150-E3/81 is a dual common-cathode ultrafast rectifier manufactured by Vishay General Semiconductor. It utilizes a glass-passivated pellet chip junction and is housed in a D2PAK (TO-263AB) surface-mount package. The device supports a maximum repetitive peak reverse voltage of 150 V and an average forward rectified current of 18 A at a case temperature of 125 °C. Key electrical characteristics include a maximum instantaneous forward voltage of 1.15 V, a maximum DC reverse current of 10 μA at 25 °C, and an ultrafast reverse recovery time of 25 ns. The component operates within a temperature range of -65 to +150 °C.
Verify the specific ordering code suffix against the manufacturer's official documentation to confirm compliance requirements such as RoHS or halogen-free status. Ensure the package type matches the intended PCB layout. Confirm availability through authorized distributors as product lifecycles may change. Validate that the thermal resistance parameters align with the system's heat dissipation design.
Select this component for applications requiring fast switching speeds and high current handling in a compact surface-mount form factor. The D2PAK package provides robust thermal performance suitable for high-power density designs. Consider the 150 V reverse voltage rating to ensure adequate margin for the specific circuit operating conditions. Evaluate the 25 ns reverse recovery time against the switching frequency requirements of the target application.
This part belongs to the BYV32 series of dual ultrafast rectifiers from Vishay. The series includes variants with different voltage ratings ranging from 50 V to 200 V. The BYVB32 designation specifically indicates the D2PAK (TO-263AB) surface-mount package configuration. These devices are designed to replace older technologies in high-frequency power conversion systems where efficiency and speed are critical.
Direct replacements within the same series include BYVB32-200-E3/81 for higher voltage tolerance. Cross-package equivalents like BYV32-150-E3/45 offer through-hole alternatives if surface-mount constraints are removed. Verify pinout compatibility and thermal resistance differences when substituting packages.
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