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Product Detailed Parameters
- Description：MVF 200MM QUALIFIED MATERIAL
- Series：*
- Mfr：Wolfspeed, Inc.
- Package：Tape & Reel (TR)
- FET Type：-
- Technology：-
- Drain to Source Voltage (Vdss)：-
- Current - Continuous Drain (Id) @ 25°C：-
- Drive Voltage (Max Rds On, Min Rds On)：-
- Rds On (Max) @ Id, Vgs：-
- Vgs(th) (Max) @ Id：-
- Gate Charge (Qg) (Max) @ Vgs：-
- Vgs (Max)：-
- Input Capacitance (Ciss) (Max) @ Vds：-
- FET Feature：-
- Power Dissipation (Max)：-
- Operating Temperature：-
- Grade：-
- Qualification：-
- Mounting Type：-
- Supplier Device Package：-
- Package / Case：-
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Overview
The Wolfspeed C3M0075120U2 is a silicon carbide (SiC) MOSFET designed for industrial applications. It features a 1200V drain-source breakdown voltage and a typical on-resistance of 75mΩ. The device utilizes a Top Side Cooling (TSC) U2 package, enabling efficient thermal management through the upper surface rather than the bottom. This configuration supports high power density designs by allowing direct mounting to heatsinks without requiring PCB space underneath.
Feature Summary
- Top Side Cooling (TSC) architecture enables direct heatsink attachment via the package top surface, improving thermal dissipation efficiency compared to traditional bottom-cooled packages.
- U2 package design provides enhanced creepage distances to support safety requirements in high-voltage systems ranging from 650V to 1200V.
- Silicon Carbide construction offers superior switching performance and temperature stability suitable for demanding industrial environments.
Applications
- Industrial motor drives
- High-efficiency power supplies
- Solar inverters
Procurement Notes
Verify the specific suffix 'U2' to confirm the Top Side Cooling package type, as standard TO-263 packages differ thermally. Ensure the component is designated for Industrial qualification rather than Automotive grade. Confirm availability status with distributors, as supply constraints may affect lead times. Validate that the selected variant matches the required thermal interface specifications for your heatsink design.
Selection Notes
Select this component when system design requires top-side thermal dissipation to free up PCB area or improve cooling efficiency. The U2 package is suitable for replacing standard bottom-cooled devices where higher creepage distances are needed for 1200V systems. Consider the 75mΩ on-resistance for conduction loss calculations in medium-power industrial applications. Ensure gate drive compatibility with SiC MOSFET characteristics.
Part Context
This part belongs to Wolfspeed's discrete Silicon Carbide MOSFET portfolio, specifically engineered for industrial markets. The U2 designation indicates the use of the Top Side Cooling package, which distinguishes it from standard surface-mount variants like the J2 package. This series supports system designers in achieving higher power densities while maintaining reliability in harsh operating conditions.
Replacement Considerations
The U2 package is designed to serve as a direct footprint replacement for other manufacturers' standard TO-263-7 packages. Verify pinout compatibility before substitution. Thermal resistance values will differ significantly from bottom-cooled alternatives; adjust heatsink design accordingly. Check if the target application requires Industrial or Automotive qualification levels.
