C8051F380-GDI

Overview

The C8051F380-GDI is a die-in-wafer form microcontroller from the Silicon Labs C8051F38x series. It features an 8-bit 8051 core operating at up to 48 MIPS, with 64 kB of in-system programmable Flash and 4352 bytes of RAM. The device integrates a full-speed USB 2.0 function controller with 1 kB endpoint RAM, two I2C/SMBus interfaces, two UARTs, and one SPI port. Analog peripherals include a 10-bit ADC capable of 500 ksps, two comparators, and a temperature sensor. It supports a supply voltage range of 2.7 V to 5.25 V and operates within a temperature range of –40 °C to +85 °C.

Feature Summary

• Integrates a high-speed 8051 CPU with pipelined architecture for efficient instruction execution.
• Includes a full-speed USB 2.0 compliant function controller with integrated transceiver and clock recovery.
• Features on-chip debug circuitry enabling non-intrusive in-system debugging without external emulators.
• Provides comprehensive analog capabilities including a multi-channel 10-bit ADC and internal voltage reference.

Applications

• Embedded USB connectivity implementations
• Motor control systems
• Sensor interface applications

Procurement Notes

Verify that the procurement source supplies the component strictly in wafer form, as indicated by the GDI suffix. Confirm compatibility with flip-chip or wire-bond assembly processes required for bare die integration. Ensure storage conditions adhere to specified humidity and temperature limits to prevent degradation before packaging.

Selection Notes

Select this component when system design requires direct die integration rather than packaged solutions. Consider the 48-pin QFP-48 bond pad mapping for PCB layout planning. Evaluate the need for external components against the integrated USB transceiver and voltage regulator capabilities to optimize bill of materials.

Part Context

This part belongs to the C8051F38x family of highly integrated USB microcontrollers. Unlike packaged variants such as the C8051F380-GQR, the GDI suffix denotes a die-in-wafer configuration intended for custom packaging or substrate mounting. It shares the same core specifications and peripheral set as its packaged counterparts within the series.

Replacement Considerations

Public confirmed substitute part numbers: None identified.