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The Intersil CA3083R4339 is a general-purpose high-current NPN transistor array featuring five independent transistors on a common monolithic substrate. It includes two matched pairs (Q1 and Q2) optimized for low current offset parameters, specifically ±5mV max VBE match and 2.5µA max IIO at 1mA. The device supports a maximum collector current of 100mA per transistor with a low saturation voltage of 0.7V max at 50mA. Independent connections allow flexible circuit design, while a separate substrate terminal ensures thermal stability. This component is RoHS compliant and Pb-free.
Verify the specific suffix R4339 against official Intersil or Renesas documentation to confirm tape-and-reel packaging specifications and lot traceability. Ensure compliance requirements such as RoHS status are explicitly stated in the final procurement datasheet. Cross-reference manufacturer part numbers as Intersil assets were acquired by Renesas Technology Corp.
Select this component when designing circuits requiring multiple matched NPN transistors with high current handling capabilities. The integrated matching of Q1 and Q2 makes it suitable for precision differential stages where discrete matching is impractical. Consider the separate substrate connection for thermal management in high-power density layouts compared to standard multi-transistor packages without dedicated thermal terminals.
The CA3083 series represents a legacy general-purpose transistor array originally manufactured by Intersil Corporation. Following corporate acquisitions, these products are now managed under Renesas Technology Corp. The CA3083R4339 variant specifically denotes the packaged form factor, likely indicating a reel-based distribution format consistent with surface-mount assembly processes.
Direct equivalents may include other NPN transistor arrays from manufacturers like ON Semiconductor or STMicroelectronics. Verify pin compatibility and electrical characteristics such as hFE matching and current ratings before substitution. Check if alternative packages offer similar thermal performance given the separate substrate requirement.