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Product Detailed Parameters
- Description：CC 93 SOM SINGLE-CORE WIRELESS
- Series：-
- Mfr：Digi
- Package：Box
- Module/Board Type：MPU Core
- Core Processor：ARM® Cortex®-A55, ARM® Cortex®-M33
- Co-Processor：-
- Speed：250MHz, 1.7GHz
- Flash Size：8GB
- RAM Size：512MB
- Connector Type：-
- Size / Dimension：1.770" L x 1.570" W (45.00mm x 40.00mm)
- Operating Temperature：-40°C ~ 85°C
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Overview
The CC-WMX-ZC6D-L1 is a Digi ConnectCore 6 Dual Lite System on Module (SOM) designed for embedded applications. It utilizes the NXP i.MX 6DualLite processor featuring dual Arm Cortex-A9 cores operating up to 800 MHz and an integrated Arm Cortex-M4 core running at 200 MHz. The module supports DDR3 memory and includes integrated wireless capabilities via an onboard transceiver supporting 802.11 b/g/n Wi-Fi and Bluetooth 4.0. It provides extensive I/O interfaces including Ethernet, USB, UART, SPI, and I2C, packaged in a compact form factor suitable for industrial environments.
Feature Summary
- Heterogeneous multi-core processing architecture combining high-performance application processing with real-time control capabilities
- Integrated wireless connectivity supporting IEEE 802.11 b/g/n standards and Bluetooth Low Energy protocols
- Comprehensive peripheral interface set including multiple serial communication ports and high-speed data buses
Applications
- Industrial automation controllers requiring reliable wireless communication
- Medical device systems needing secure data transmission and processing
- Smart building infrastructure nodes for environmental monitoring
Procurement Notes
Verify the specific hardware revision and wireless certification status before procurement. Confirm that the required operating temperature range matches the industrial grade specifications of this SOM variant. Ensure compatibility with the chosen carrier board design regarding pin mapping and power requirements. Check for any recent product change notifications affecting component sourcing or firmware support timelines.
Selection Notes
Select this module when both application-level processing and deterministic real-time tasks are required within a single system. The integrated wireless solution reduces bill-of-materials complexity compared to discrete components. Consider the thermal performance characteristics if the enclosure design limits passive cooling options. Evaluate the available software development tools and Linux BSP support maturity for the target operating system.
Part Context
This System on Module belongs to the Digi ConnectCore 6 family, which is built around the NXP i.MX 6 series processors. These modules are engineered to accelerate time-to-market for embedded products by providing a pre-certified wireless and computing platform. The family targets industries such as healthcare, transportation, and industrial IoT where reliability and security are paramount.
Replacement Considerations
Direct replacements include other variants within the ConnectCore 6 family such as the CC-WMX-ZC6D-L2 for different wireless configurations or the CC-WMX-ZC6Q series for higher processing power. Verify mechanical footprint compatibility with existing carrier boards when switching between different processor counts or memory capacities within the same generation.
