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CC2591RGVRG4 is listed in the RF Front End (LNA + PA) range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC RF FRONT END 2.4GHZ 16-QFN. Review the specifications below when checking this part for your BOM.
The CC2591RGVRG4 is a 2.4 GHz RF front-end module manufactured by Texas Instruments, designed for IEEE 802.15.4 and Zigbee applications. It integrates a low-noise amplifier (LNA) and a power amplifier (PA) to extend communication range in wireless sensor networks. The device operates within a temperature range of -40°C to 85°C and is housed in a 16-pin VQFN package with an exposed thermal pad. This component serves as a critical interface between the transceiver and the antenna, optimizing signal integrity and transmission efficiency.
Verify the specific ordering suffix 'G4' to ensure compliance with RoHS3 standards and lead-free requirements. Confirm that the package designation matches the 16-VQFN form factor with the correct thermal pad configuration. Cross-reference the manufacturer part number against official Texas Instruments documentation to avoid counterfeit components or incorrect revisions.
Select this component when extending the range of standard 2.4 GHz transceivers is required for Zigbee or 802.15.4 networks. Ensure the host microcontroller supports the necessary control interfaces for gain switching and enable signals. Consider the thermal management requirements associated with the exposed pad design during PCB layout to maintain performance within the specified operating temperature range.
This part belongs to the CC2591 family of RF front-ends from Texas Instruments. It is functionally equivalent to variants such as CC2591RGVT but differs in packaging and reel specifications. The 'G4' suffix typically indicates a lead-free and RoHS-compliant version of the base CC2591 product line, intended for use in environmentally regulated manufacturing processes.
The CC2591RGVT is a direct functional substitute with identical electrical characteristics, differing primarily in tape-and-reel packaging specifications. Verify that the alternative package variant meets the thermal and mechanical constraints of the existing PCB footprint.
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