ChipApex | Global Electronic Components Supplier
SEARCH
Search Product
Search Post
— IC芯片 | 连接器 | 传感器 | 被动器件 —
Consult the customer manager about the wholesale price.
consultation hotline：86-132-6715-2157
email：[email protected]
Contact the product manager for consultation. One-stop consultation is available.
Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.
Product Detailed Parameters
- Description：DIODE SCHOTTKY 100V 1A DIE
- Series：-
- Mfr：Microchip Technology
- Package：Tape & Reel (TR)
- Technology：Schottky
- Voltage - DC Reverse (Vr) (Max)：100 V
- Current - Average Rectified (Io)：1A
- Voltage - Forward (Vf) (Max) @ If：750 mV @ 1 A
- Speed：Fast Recovery =< 500ns, > 200mA (Io)
- Reverse Recovery Time (trr)：-
- Current - Reverse Leakage @ Vr：100 µA @ 100 V
- Capacitance @ Vr, F：-
- Mounting Type：Surface Mount
- Package / Case：Die
- Supplier Device Package：Die
- Operating Temperature - Junction：-55°C ~ 125°C
- Grade：Military
- Qualification：MIL-PRF-19500/586
Download product information
Overview
The CD1A100 is a Schottky barrier rectifier die manufactured by Microchip Technology. It features a single diode configuration with a maximum repetitive peak reverse voltage of 100 V and an average forward rectified current rating of 1 A. The component utilizes surface mount technology in a bare die format, designed for integration into custom semiconductor assemblies or advanced packaging solutions requiring high-efficiency power conversion.
Feature Summary
- Schottky barrier construction for low forward voltage drop
- High switching efficiency suitable for power applications
- Bare die format for flexible system integration
Applications
- General purpose rectification in power supplies
- Free-wheeling diodes in DC-DC converters
- Protection diodes in electronic circuits
Procurement Notes
Verify the specific datasheet version and mechanical dimensions directly with Microchip Technology or authorized distributors before procurement. As a bare die component, ensure that your assembly process supports die attachment and wire bonding requirements. Confirm that the 100 V reverse voltage and 1 A current ratings align with your circuit design constraints to prevent device failure.
Selection Notes
Select the CD1A100 when a compact, high-efficiency Schottky solution is required in a bare die form factor. Consider this component for designs where space constraints preclude standard packages and where custom packaging is feasible. Ensure thermal management strategies account for the die's power dissipation characteristics under the intended load conditions.
Part Context
Microchip Technology specializes in microcontroller, mixed-signal, and analog semiconductor solutions. The CD1A100 falls within their discrete diode portfolio, offering reliable performance for power management applications. This component complements their broader range of electronic components used in industrial, automotive, and consumer electronics markets.
Replacement Considerations
Public confirmed substitute part numbers are not available in the provided documentation. Consult Microchip Technology for recommended alternatives or cross-reference options based on specific electrical and mechanical requirements.
