CD1A40

$2.50

Description：DIODE SCHOTTKY 40V 1A DIE
Series：-
Mfr：Microchip Technology
Package：Tape & Reel (TR)

SKU:84803298bda2 Category: Single Diodes Brand: Microchip Technology

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Product introduction

Product Detailed Parameters

Description：DIODE SCHOTTKY 40V 1A DIE
Series：-
Mfr：Microchip Technology
Package：Tape & Reel (TR)
Technology：Schottky
Voltage - DC Reverse (Vr) (Max)：40 V
Current - Average Rectified (Io)：1A
Voltage - Forward (Vf) (Max) @ If：600 mV @ 1 A
Speed：Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr)：-
Current - Reverse Leakage @ Vr：100 µA @ 40 V
Capacitance @ Vr, F：-
Mounting Type：Surface Mount
Package / Case：Die
Supplier Device Package：Die
Operating Temperature - Junction：-55°C ~ 125°C
Grade：-
Qualification：-

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CD1A40

Overview

The CD1A40 is a single Schottky barrier rectifier die manufactured by Microchip Technology. It features a maximum repetitive peak reverse voltage of 40 V and an average forward rectified current rating of 1 A. The device utilizes a surface-mount Chip-2 package configuration. Key electrical specifications include a maximum DC forward voltage drop of 0.55 V at rated current and a maximum RMS isolation voltage of 600 V. Thermal characteristics specify a junction-to-case thermal resistance of 35°C/W, with a maximum operating junction temperature of 175°C.

Feature Summary

Schottky barrier construction for low forward voltage drop
High surge current capability
Designed for high-frequency rectification applications

Applications

DC-DC converter output rectification
Free-wheeling diodes in power supplies
Reverse polarity protection circuits

Procurement Notes

Verify the specific datasheet revision to confirm exact thermal resistance values and absolute maximum ratings. Ensure the procurement specification explicitly requires the bare die form factor rather than packaged equivalents. Confirm RoHS compliance status matches project requirements before finalizing orders.

Selection Notes

Select this component when a compact, high-current Schottky solution is required for space-constrained designs. Evaluate the thermal management strategy carefully due to the exposed die structure. Compare the forward voltage characteristics against alternative packages to ensure efficiency targets are met within the system's thermal envelope.

Part Context

This part belongs to Microchip's discrete semiconductor portfolio, specifically categorized under single Schottky diodes. It serves as a bare die option for manufacturers integrating custom packaging solutions or utilizing advanced substrate technologies in high-density power electronics assemblies.