CD1A45

Overview

The CD1A45 is a Schottky barrier rectifier diode die manufactured by Microchip Technology. It is designed for high-efficiency rectification applications in surface-mount configurations. The component features a maximum repetitive peak reverse voltage of 45 V and an average forward rectified current rating of 1 A. It utilizes a Die package type, suitable for integration into custom substrates or advanced packaging solutions. The device operates within a standard temperature range, providing reliable performance for power management circuits requiring low forward voltage drop and fast switching characteristics.

Feature Summary

• Schottky barrier technology for reduced forward voltage drop
• Die-level form factor for flexible integration
• High-efficiency rectification capability

Applications

• High-frequency power supply rectification
• DC-DC converter input/output stages
• Custom integrated circuit packaging

Procurement Notes

Verify the specific die attachment requirements and substrate compatibility before procurement. Confirm that the ordering information matches the exact die specifications required for your assembly process. Ensure handling procedures account for the bare die nature of the component to prevent mechanical damage during placement.

Selection Notes

Select this component when a discrete surface-mount diode is insufficient due to space constraints or thermal requirements. It is appropriate for designs where the manufacturer can integrate the die directly onto a carrier or PCB. Consider the 45 V reverse voltage and 1 A current ratings against the circuit's peak load conditions.

Part Context

This part belongs to Microchip Technology's discrete semiconductor portfolio, specifically within the Schottky diode category. Unlike packaged equivalents, the die format allows for higher density integration in specialized electronic assemblies. It serves as a fundamental building block for power conversion systems requiring robust rectification in compact footprints.

Replacement Considerations

Direct replacement requires matching the die dimensions and electrical characteristics. Verify if alternative dies from other manufacturers fit the existing footprint and thermal interface without redesigning the substrate.