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Product Detailed Parameters
- Description：DIODE SCHOTTKY 30V 3A DIE
- Series：-
- Mfr：Microchip Technology
- Package：Tape & Reel (TR)
- Technology：Schottky
- Voltage - DC Reverse (Vr) (Max)：30 V
- Current - Average Rectified (Io)：3A
- Voltage - Forward (Vf) (Max) @ If：550 mV @ 3 A
- Speed：Fast Recovery =< 500ns, > 200mA (Io)
- Reverse Recovery Time (trr)：-
- Current - Reverse Leakage @ Vr：100 µA @ 30 V
- Capacitance @ Vr, F：-
- Mounting Type：Surface Mount
- Package / Case：Die
- Supplier Device Package：Die
- Operating Temperature - Junction：-65°C ~ 125°C
- Grade：-
- Qualification：-
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Overview
The CD3A30 is a silicon Schottky rectifier die manufactured by Microchip Technology. It provides a maximum repetitive peak reverse voltage of 30 V and an average rectified current capability of 3 A. The device features a low forward voltage drop, specified at a maximum of 550 mV when conducting 3 A. Designed for surface mount integration, this component utilizes a bare die package format suitable for custom substrate mounting in high-efficiency power rectification applications.
Feature Summary
- Schottky barrier technology ensures fast switching speeds and minimal reverse recovery charge.
- Low forward voltage drop characteristic enhances overall system efficiency during conduction.
- Bare die construction allows for flexible integration into custom power modules.
Applications
- High-efficiency DC-DC converter output rectification
- Free-wheeling diode implementation in synchronous buck circuits
- Power supply input protection stages
Procurement Notes
Verify the specific datasheet revision and electrical test conditions provided by Microchip Technology before finalizing design specifications. Confirm that the bare die form factor aligns with your assembly capabilities, as standard through-hole or surface-mount packages are not available for this part number. Ensure compliance with RoHS directives as indicated in official documentation.
Selection Notes
Select the CD3A30 when designing compact power systems requiring high efficiency and fast switching characteristics. This component is appropriate for applications where space constraints necessitate a bare die solution rather than a packaged diode. Evaluate thermal management requirements carefully, as heat dissipation depends on the substrate material and soldering process used during integration.
Part Context
This component belongs to Microchip Technology's portfolio of small-signal Schottky diodes and rectifiers. It complements other discrete semiconductor devices offered by the manufacturer for power management and signal conditioning applications. The product line focuses on providing reliable silicon-based solutions for various industrial and consumer electronics markets.
Replacement Considerations
Consult Microchip Technology official documentation for verified substitute part numbers. Cross-referencing with other manufacturers requires careful comparison of absolute maximum ratings and thermal characteristics to ensure functional compatibility.
