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The CD5817 is a small-signal Schottky rectifying die manufactured by Microchip Technology. It features a maximum DC reverse voltage (Vr) of 20 V and an average rectified forward current (Io) of 1 A. The device exhibits a maximum forward voltage (Vf) of 0.6 V at the rated current and a leakage current (Ir) of 0.1 mA at the maximum reverse voltage. Designed for surface-mount applications, it utilizes a bare die configuration suitable for custom packaging or integration into specialized semiconductor assemblies.
Verify the specific die specifications and handling requirements with Microchip Technology before procurement. Ensure that the application design accounts for the bare die nature of the component, including appropriate mounting and protection mechanisms. Confirm compliance with relevant environmental standards such as RoHS3 if required for the final assembly.
Select the CD5817 when a compact, high-efficiency Schottky rectifier is needed in a bare die form factor. It is suitable for designs requiring a 20 V reverse voltage rating and 1 A current capacity within a surface-mountable footprint. Consider thermal management and mechanical stability during integration due to the exposed die structure.
The CD5817 belongs to Microchip Technology's small-signal Schottky diode family. It shares electrical characteristics with packaged variants like the 1N5817 but is provided as a bare die. This allows system designers to incorporate the rectification function directly into custom substrates or hybrid circuits, optimizing space and performance in advanced electronic systems.
For equivalent functionality in a packaged form, consider the 1N5817 (DO-41) or UPS5817E3/TR7 (Powermite 1). These components offer similar 20 V, 1 A ratings but include integrated packages for standard mounting.