CD6759

Overview

The CD6759 is a single Schottky barrier rectifier die manufactured by Microchip Technology. It is designed for surface mount applications and operates with a maximum repetitive peak reverse voltage of 60 V and an average forward rectified current of 1 A. The component utilizes a bare die package format, intended for integration into custom substrates or advanced packaging solutions rather than standard through-hole or surface-mount footprints.

Feature Summary

• Schottky barrier construction for low forward voltage drop
• Bare die configuration for flexible substrate integration
• Surface mount design suitable for high-volume assembly

Applications

• DC-DC converter input/output rectification
• Free-wheeling diode in synchronous rectifier circuits
• Power supply protection against reverse polarity

Procurement Notes

Verify the specific die attachment requirements and substrate compatibility before procurement. Confirm that the selected manufacturing process supports bare die handling and wire bonding protocols. Ensure that thermal management strategies account for the exposed die structure to maintain reliability under load conditions.

Selection Notes

Select this component when a compact, high-efficiency rectification solution is required within a custom power module. Consider the 60 V rating and 1 A current capacity against circuit demands. Evaluate the mechanical constraints of bare die mounting versus packaged alternatives for space-limited designs.

Part Context

This device belongs to Microchip's small-signal Schottky diode family. It provides a cost-effective and space-saving alternative to packaged diodes in applications where custom hybrid circuits or multi-chip modules are employed. The die format allows for higher packing density in specialized electronic assemblies.

Replacement Considerations

No public confirmed substitute part numbers are available in the provided documentation.