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CD74HC02EG4 is listed in the Inverter Gates range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC GATE NOR 4CH 2-INP 14DIP. Review the specifications below when checking this part for your BOM.
The CD74HC02EG4 is a high-speed CMOS logic integrated circuit manufactured by Texas Instruments. It contains four independent 2-input NOR gates housed in a 14-pin DIP package. The device operates within a supply voltage range of 2V to 6V, with low-level input thresholds between 0.5V and 1.8V, and high-level input thresholds between 1.5V and 4.2V. Maximum propagation delay is specified at 15ns @ 6V, 50pF. Output drive capability is 5.2mA for both high and low states. Operating temperature ranges from -55°C to 125°C.
Verify the 'E4' suffix indicates lead-free composition and RoHS compliance per manufacturer documentation. Confirm the package type matches design requirements, as variants exist in SOIC and other formats. Ensure the ordering part number aligns with the specific package style needed for the PCB layout.
Select this component when four independent NOR gates are required in a through-hole DIP configuration. Compare against standard CD74HC02 if lead-free certification is mandatory. Verify that the 5.2mA output current meets load requirements. Check compatibility with system voltage levels, specifically ensuring inputs stay within the defined threshold ranges for reliable operation.
This part belongs to the Texas Instruments 74HC series of high-speed CMOS logic devices. The 74HC family offers performance comparable to LS-TTL but with lower power consumption. The CD prefix typically denotes commercial grade temperature range, though this specific variant supports extended temperatures. It serves as a direct functional replacement for equivalent industry-standard NOR gate ICs.
The CD74HC02M96 is a documented alternative offering identical logical functionality in an SOIC surface-mount package. Verify pinout compatibility before substitution. Other generic 74HC02 equivalents may be suitable if package form factor allows.
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