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CD74HC27M96 is listed in the Inverter Gates range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC GATE NOR 3CH 3-INP 14SOIC. Review the specifications below when checking this part for your BOM.
The CD74HC27M96 is a triple 3-input NOR gate integrated circuit manufactured by Texas Instruments. It operates within a supply voltage range of 2V to 6V and features output currents of 5.2mA for both high and low states. The device exhibits a maximum propagation delay of 16ns at 6V with a 50pF load. It supports logic levels from 0.5V to 1.8V (low) and 1.5V to 4.2V (high). The component is housed in a 14-SOIC package, suitable for surface mount installation, and functions reliably across an operating temperature range of -55°C to 125°C.
Verify the specific ordering suffix to ensure the correct tape and reel configuration matches your assembly requirements. Confirm that the RoHS status aligns with environmental compliance standards for your region. Ensure the moisture sensitivity level is managed appropriately during storage and handling to maintain device integrity before soldering.
Select this component when a triple 3-input NOR gate is required in a surface-mount SOIC package. Consider the 2V to 6V supply range and 5.2mA drive capability against system power constraints. Evaluate the -55°C to 125°C operating temperature range against environmental conditions. Compare propagation delay specifications with timing requirements of the target digital application.
This part belongs to the Texas Instruments 74HC series of high-speed CMOS logic devices. The 74HC27 family specifically provides triple 3-input NOR gates. The M96 suffix typically denotes a specific packaging or tape-and-reel variant within the broader 74HC27 product line, sharing core electrical characteristics with other variants in the series.
Compatible substitutes include SN74HC27DR and other 74HC27 variants from Texas Instruments or Nexperia. Verify pin compatibility and electrical parameters such as supply voltage and output current when substituting. Ensure the replacement package matches the footprint requirements of the existing design.
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