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The CD74HC377E is an octal D-type flip-flop manufactured by Harris Corporation, belonging to the HC/UH CMOS logic series. It features a single functional block with positive edge triggering and true outputs. The device is housed in a 20-pin plastic dual in-line package (PDIP-20). It operates within a supply voltage range of 2V to 6V, supporting a maximum clock frequency of 20MHz at nominal supply. The component is rated for an extended operating temperature range from -55°C to +125°C, ensuring reliability in demanding environments.
Verify that the specific part number matches the Harris Corporation manufacturing origin rather than Texas Instruments successors. Confirm the PDIP-20 through-hole package variant is required for the design. Ensure compliance with RoHS directives if applicable, as older Harris batches may not meet current environmental standards. Validate supplier documentation against original datasheets to confirm electrical specifications.
Select this component when high-speed octal latching is required with standard CMOS compatibility. The HC series offers balanced performance suitable for general-purpose digital logic applications. Consider the 20-pin DIP package for prototyping or legacy board designs. Verify input clamp diode requirements and load capacitance limits to ensure signal integrity at maximum operating frequencies.
This component belongs to the widely adopted 74HC logic family, known for high speed and low power consumption. The CD74HC377 specifically addresses the need for multi-bit storage in digital systems. As a Harris product, it represents the pre-acquisition lineage now often managed under Texas Instruments portfolios, maintaining pin-out and functional compatibility with industry standards.
The CD74HC377E can be functionally replaced by the SN74HC377N or CD74HC377M96. These alternatives share identical logical functionality and pin assignments. Verify package type differences, such as switching from DIP to SOIC, before substitution. Ensure voltage and temperature ratings match the application requirements.