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The CDBA240LR-HF is a Schottky barrier rectifier manufactured by Comchip Technology. It features a maximum repetitive peak reverse voltage of 40 V and an average forward rectified current of 2 A. The device utilizes a low-profile surface-mount package, specifically the DO-214AC (SMA) configuration. Key electrical characteristics include a low forward voltage drop to minimize power loss and high surge current capability for transient protection. The component is designed for ultra-high-speed switching applications and operates within a junction temperature range of -55°C to +150°C.
Verify the specific suffix 'LR' against the official Comchip Technology datasheet to confirm package tolerance or marking variations. Ensure the ordering part number matches the required RoHS compliance status and packaging format. Cross-reference the manufacturer's latest revision history to validate pinout compatibility and electrical specifications before integration into production designs.
Select this component when space constraints necessitate a low-profile SMA package while maintaining 2 A current handling. Evaluate the forward voltage drop at the expected operating current to ensure thermal management requirements are met. Confirm that the 40 V reverse voltage rating provides sufficient margin for the circuit's peak inverse voltage conditions during normal operation and transient events.
This device belongs to the Comchip Technology CDBA series of Schottky barrier rectifiers. The series is characterized by silicon epitaxial planar chips with metal-silicon junctions. These components are engineered for high reliability and environmental compliance, meeting lead-free standards. The family targets applications demanding fast recovery times and low conduction losses in compact form factors.
Publicly confirmed substitute part numbers for CDBA240LR-HF were not identified in the provided documentation. Verify cross-references with other manufacturers offering 40 V, 2 A SMA Schottky diodes only after confirming exact electrical parameter alignment and package dimensional tolerances.