CDBB2150LR-HF

Overview

The CDBB2150LR-HF is a Schottky Barrier Rectifier manufactured by Comchip Technology. It is designed for low profile surface mounted applications to optimize board space. The device features batch process design and silicon epitaxial planar chip construction with a metal silicon junction. It offers excellent power dissipation, resulting in improved reverse leakage current and thermal resistance characteristics suitable for high-efficiency circuits.

Feature Summary

• Low profile package design that is significantly thinner than standard packages to optimize board space
• Batch process design providing excellent power dissipation and superior reverse leakage current performance
• Ultra-high-speed switching capability combined with high surge current handling
• Guarding functionality for overvoltage protection

Applications

• Low profile surface mounted applications requiring optimized board space
• General purpose rectification in electronic circuits
• Overvoltage protection guarding

Procurement Notes

Verify the specific datasheet version when sourcing, as manufacturing specifications may evolve. Confirm RoHS compliance status directly with the manufacturer or authorized distributor, as transition periods can affect certification documentation. Ensure the ordering part number matches the exact suffix requirements for lead-free and halogen-free attributes specified in official product literature.

Selection Notes

Select this component for designs prioritizing low profile form factors and efficient thermal management. The batch process technology ensures consistent reverse leakage current and thermal resistance. Evaluate the forward voltage drop and surge current capabilities against circuit requirements to ensure compatibility with high-efficiency and high-speed switching applications.

Part Context

This component belongs to the CDBB Series of SMD Schottky Barrier Rectifiers from Comchip Technology. The series utilizes silicon epitaxial planar chips and metal silicon junctions. These devices are engineered for low power loss and high efficiency, featuring low forward voltage drops and high current capabilities within compact surface mount packages.

Replacement Considerations

Public confirmed substitute part numbers are not available in the provided source material.