CDBQR0140L

Overview

The CDBQR0140L is a surface-mount Schottky barrier diode manufactured by Comchip Technology. It features a maximum repetitive peak reverse voltage of 40V and an average forward rectified current rating of 100mA. The device utilizes an extremely thin, leadless package designed for small surface mounting applications. Key electrical characteristics include low reverse leakage current and majority carrier conduction, which contribute to high efficiency and fast switching speeds suitable for low-voltage circuits.

Feature Summary

• Extremely thin and leadless package design optimized for space-constrained surface mounting
• Low forward voltage drop and low reverse leakage current for enhanced efficiency
• Majority carrier conduction enabling ultra-high-speed switching capabilities

Applications

• Low-voltage rectification in compact electronic devices
• High-frequency switching circuits requiring minimal parasitic effects
• Surface-mounted power management modules with strict height restrictions

Procurement Notes

Verify the specific suffix designation against official Comchip Technology documentation to confirm exact electrical tolerances and marking codes. Ensure that the selected variant matches the required package dimensions and thermal specifications for the intended application environment. Cross-reference datasheet revisions to validate compliance with current environmental standards before finalizing procurement orders.

Selection Notes

Select this component when board space is limited due to its leadless form factor. Consider the 100mA current rating and 40V voltage limit to ensure adequate headroom for the target circuit. Evaluate the thermal performance requirements against the package's dissipation capabilities. Confirm compatibility with automated surface-mount assembly processes given the specialized package geometry.

Part Context

This component belongs to the Comchip Technology SMD Schottky Barrier Diode family. It is engineered specifically for applications demanding low profile and high reliability. The series emphasizes batch process design to maintain consistent electrical parameters across production runs while meeting environmental compliance standards for modern electronics manufacturing.

Replacement Considerations

Consult official substitution guides for compatible equivalents. Verify that any alternative part maintains identical voltage ratings, current capabilities, and package footprint to ensure seamless integration without redesigning the printed circuit board layout or revalidating thermal performance constraints.