CDBV3-00340C-G

Diode Arrays Overview

The CDBV3-00340C-G is a Schottky diode array manufactured by Comchip Technology, designed for surface mount applications. It features a common cathode configuration with one pair of diodes housed in an SC-70 (SOT-323) package. The device utilizes silicon epitaxial planar chip technology and metal-silicon junctions to ensure high-speed switching capabilities. Key electrical specifications include a maximum repetitive reverse voltage of 40 V and an average forward current rating of 30 mA. The typical forward voltage drop is 370 mV at the rated current, while the reverse leakage current is specified at 500 nA.

Diode Arrays Feature Summary

• Common cathode dual-diode configuration within a compact surface-mount footprint
• Ultra-high-speed switching characteristics enabled by metal-silicon junction technology
• Low forward voltage drop for improved power efficiency in signal paths
• Batch process design providing consistent thermal resistance and low reverse leakage

Diode Arrays Applications

• High-frequency signal rectification in communication circuits
• Clamping and protection of sensitive logic inputs
• Small-signal detection in RF front-end modules
• Power management circuits requiring low-voltage drop components

Diode Arrays Procurement Notes

Verify component authenticity by cross-referencing the manufacturer's part number CDBV3-00340C-G with official Comchip Technology documentation. Ensure the received units match the specified SOT-323 package outline and pinout configuration. Confirm RoHS compliance status through provided certificates of conformity. Validate that the batch corresponds to the correct manufacturing date code to avoid obsolescence issues during production integration.

Diode Arrays Selection Notes

Select this component when a dual Schottky diode solution is required in a minimal board space constraint. The 40 V reverse voltage rating suits low-voltage digital systems, while the 30 mA current capability supports small-signal operations. Consider the SOT-323 package for automated assembly processes where height restrictions are critical. Compare performance against single-diode alternatives if isolation between channels is not required.

Diode Arrays Part Context

This device belongs to the CDBV3 series of small-signal Schottky diodes from Comchip Technology. The series focuses on optimizing board space through low-profile surface mount packages. It complements other single-diode variants like the CDBP00340-G by offering integrated dual-channel functionality. The technology leverages silicon epitaxial planar chips for reliable operation across standard industrial temperature ranges.

Diode Arrays Replacement Considerations

Direct substitutes must maintain the SOT-323 package, 40 V reverse voltage, and common cathode configuration. Verify that alternative parts meet the 30 mA forward current requirement and similar forward voltage characteristics. Ensure compatibility with existing PCB footprints and reflow soldering profiles.