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CDBV3-54S-G is listed in the Diode Arrays range at ChipApex. The manufacturer field lists Comchip Technology. Its product description is DIODE ARR SCHOT 30V 200MA SOT323. Review the specifications below when checking this part for your BOM.
The CDBV3-54S-G is a dual series Schottky barrier rectifier manufactured by Comchip Technology. It utilizes silicon epitaxial planar chip technology with a metal-silicon junction, housed in an SOT-323-3 surface-mount package. The device supports a repetitive reverse voltage of 30 V and an average forward current of 200 mA. Key electrical characteristics include a maximum forward voltage of 1 V, a peak forward surge current capability of 600 mA, and a low reverse leakage current of 200 nA. It operates reliably within a temperature range from -55 °C to +125 °C.
Verify the specific suffix against official Comchip Technology documentation to confirm exact electrical tolerances and packaging specifications. Ensure the ordering code matches the required SOT-323-3 package variant. Cross-reference datasheet revisions to validate compliance with current environmental standards before finalizing procurement orders.
Select this component when a compact dual-diode solution is required for low-voltage, low-current applications. The SOT-323-3 package offers significant board space savings compared to larger packages. Consider the 30 V reverse voltage rating and 200 mA current limit to ensure adequate headroom for the target circuit design requirements.
This part belongs to the CDBV3-54 series of low-profile Schottky barrier rectifiers from Comchip Technology. The series is designed to provide high-efficiency rectification in minimal footprints. It complements other Comchip offerings like the CDBT-54S-G, which shares similar electrical ratings but utilizes a different SOT-23-3 package format for varied mechanical integration needs.
The BAT54S-G is a documented alternative from Comchip Technology offering identical 30 V / 200 mA specifications. Verify pinout compatibility and physical dimensions between the SOT-323-3 and SOT-23-3 packages during substitution to ensure proper PCB footprint alignment.
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