CDC351IDBG4

Overview

The CDC351IDBG4 is a single-circuit fanout buffer and clock distribution device manufactured by Texas Instruments. It accepts an LVTTL input signal and provides ten LVTTL tri-state outputs, achieving a 1:10 fan-out ratio without differential signaling capabilities. The component supports maximum operating frequencies up to 100 MHz and functions within a supply voltage range of 3V to 3.6V. Designed for surface mount applications, it utilizes a 24-SSOP package with a width of 5.30mm. The device is rated for industrial temperature operation spanning from -40°C to +85°C.

Feature Summary

• Single circuit providing 1:10 fan-out distribution
• LVTTL input with LVTTL tri-state outputs
• Maximum frequency performance of 100 MHz
• Operates on 3V to 3.6V power supply
• Industrial temperature range (-40°C to +85°C)

Applications

• Clock distribution in high-speed digital systems
• Buffering reference clocks for multiple loads
• Signal routing in embedded processing architectures

Procurement Notes

Verify the specific ordering suffix against official manufacturer documentation to confirm package type and qualification status. Ensure that the selected variant matches the required thermal and electrical specifications for the target application environment before finalizing procurement orders.

Selection Notes

Select this component when a single-ended LVTTL source requires driving ten distinct LVTTL destinations. Confirm that the system voltage remains within the 3V to 3.6V window and that the 100 MHz frequency limit satisfies the design requirements. Verify physical space constraints for the 24-SSOP footprint during PCB layout planning.

Part Context

This part belongs to the CDC351 family of clock buffers. Variants such as the IDW and IDWR utilize SOIC packaging, while the DBG4 designation indicates the SSOP package configuration. These devices serve as fundamental building blocks for clock tree management in digital logic circuits requiring signal regeneration and distribution.

Replacement Considerations

Direct replacements include other CDC351 variants like the CDC351IDB or CDC351IDWR, provided the package form factor difference between SSOP and SOIC/Tape & Reel is accommodated in the mechanical design. Cross-package substitution requires verifying pin compatibility and thermal dissipation characteristics.