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The CM200DU-24H is a dual IGBT module manufactured by Powerex Inc., designed for high-power switching applications. It integrates two insulated gate bipolar transistors with built-in anti-parallel diodes in a single package. The module supports collector currents up to 200 Amperes and withstands collector-emitter voltages of 1200 Volts. It features an isolated flange mount configuration, facilitating efficient thermal management through direct heatsink attachment. The component is engineered for operation at junction temperatures reaching 150 °C, ensuring reliability in demanding power conversion environments.
Verify the manufacturer designation on the datasheet, as Powerex and Mitsubishi Electric Semiconductor share this part number lineage. Confirm that the specific revision matches the required electrical characteristics for your circuit design. Ensure the supplier provides original packaging documentation to guarantee component authenticity and traceability prior to purchase.
Select this module when designing circuits requiring 1200V blocking voltage and 200A continuous current handling. Verify that the driving circuitry supports the gate charge requirements and switching speeds specified in the official datasheet. Ensure the thermal interface material and heatsink capacity can maintain the junction temperature below the 150 °C maximum limit under full load conditions.
This component belongs to the NFH-Series Dual IGBT modules, which are engineered for high-frequency switching operations. The series is characterized by its robust construction for industrial power electronics. It serves as a core switching element in converters where high efficiency and compact form factors are critical for system performance and reliability.
Cross-reference with CM200DU-24NFH or CM200DY-24H from Mitsubishi Electric Semiconductor. Verify pinout compatibility and thermal resistance values before substitution. Ensure the replacement part meets the same 1200V/200A specifications and mounting dimensions to fit existing PCB layouts and cooling structures.