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The CM400DU-24H is a dual IGBT module manufactured by Powerex Inc., designed for high-power switching applications. It features a half-bridge configuration with two N-channel insulated gate bipolar transistors and integrated super-fast recovery free-wheel diodes. The module supports a maximum collector-emitter voltage of 1200 V and a continuous collector current of 400 A. It utilizes an isolated baseplate for efficient thermal management and system assembly. The component operates at a maximum junction temperature of 150 °C and is housed in a flange-mount package with seven terminals, ensuring electrical isolation between the heat sink and internal components.
Verify the specific suffix 'H' against official Powerex documentation to confirm pinout and mechanical dimensions, as variations exist within the series. Ensure compatibility with required gate drive voltages and thermal interface materials. Cross-reference the manufacturer part number with authorized distributors to confirm current production status and compliance certifications such as UL recognition.
Select this module for applications requiring robust high-current handling and fast switching speeds. The 1200V rating suits medium-voltage industrial environments. Consider the thermal resistance of the isolated baseplate when designing the cooling solution. Verify that the gate drive circuitry can support the switching frequencies up to 70 kHz for optimal performance in soft-switching topologies.
This component belongs to the Powerex IGBTMOD series, which focuses on high-power density solutions. The DU designation typically indicates a dual unit (half-bridge) configuration. The series is engineered for reliability in demanding power electronics environments, offering a balance of low switching losses and high surge current capability compared to standard discrete modules.
Direct replacements may include the CM400DU-24NFH or CM400DX-24S from Mitsubishi/Powerex, provided pinouts and thermal characteristics match. Always verify electrical parameters and mechanical footprint before substitution.