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The CMX469AD3-TR1K is a full-duplex modem integrated circuit manufactured by CML Microcircuits. It supports baud rates of 1200, 2400, and 4800 bps using FFSK or MSK modulation schemes. The device operates on a single power supply ranging from 2.7V to 5.5V with a typical operating current of 4.5 mA. It is housed in a 20-SOIC surface-mount package with a width of 7.50 mm. The component functions as a modulator/demodulator for telecom interface applications.
Verify the specific suffix TR1K against official manufacturer documentation to confirm tape and reel packaging details. Ensure the part number matches the exact SOIC-20 variant intended for the design. Cross-reference RoHS compliance status and moisture sensitivity levels prior to procurement to meet assembly requirements.
Select this component when designing circuits requiring full-duplex communication at standard telephony speeds. Verify that the system power supply remains within the 2.7V to 5.5V operational limits. Confirm that the 20-SOIC footprint aligns with the PCB layout constraints and thermal management needs of the target application.
This part belongs to the CMX469 series of telecom interface ICs. It serves as a specialized modem solution for embedded communication systems. The AD3 designation typically indicates the SOIC-20 package variant, distinguishing it from other package options like TSSOP available within the same functional family.
The CMX469AE2 offers identical electrical functionality but utilizes a 24-TSSOP package. Designers must evaluate pinout compatibility and physical footprint differences before substituting one for the other.