CMX969D5

Overview

The CMX969D5 is a CMOS integrated circuit providing baseband signal processing and Medium Access Control (MAC) protocol functions for wireless packet data modems. It supports DataTAC, Motient/ARDIS, Dual Mode RD-LAP (19200 bps), and MDC 4800 (4800 bps) FSK standards. The device interfaces with host processors via an 8-bit parallel bus and handles forward error correction (FEC), CRC generation/checking, and interleaving. Operating on a single supply of 3.0V to 5.5V, it features autonomous frame sync detection for Single Frequency Re-use systems. The D5 suffix indicates the TSSOP package variant.

Feature Summary

• Supports Dual Mode RD-LAP and MDC 4800 protocols with full packet data framing capabilities
• Integrates Forward Error Correction (FEC), Cyclic Redundancy Check (CRC), and interleaving for burst-error protection
• Includes Autonomous Frame Sync Detection function for Single Frequency Re-use operations
• Provides programmable operation with wide choice of crystal frequencies

Applications

• Two-way paging equipment
• Mobile data systems
• Wireless telemetry
• DataTAC terminals

Procurement Notes

Verify the ordering suffix 'D5' corresponds to the TSSOP package configuration required for your design. Confirm that the component meets all electrical specifications for your operating voltage range. Ensure compatibility with the host processor interface requirements before finalizing procurement.

Selection Notes

Select this component for applications requiring compliance with Motorola RD-LAP or MDC 4800 air interface standards. Consider the low power consumption and powersave option if battery life is critical. Ensure the system architecture can accommodate the 8-bit parallel microcontroller interface and necessary external crystal components.

Part Context

The CMX969 series includes variants such as the CMX969E2 (SSOP) and CMX969P4 (DIP). The CMX969D5 specifically denotes the Thin Shrink Small Outline Package (TSSOP) version. All variants share identical internal functionality and pinout assignments, differing only in physical packaging dimensions.

Replacement Considerations

No public confirmed substitute part numbers are available.