CNY75AXSM

Overview

The CNY75AXSM is a single-channel optoisolator manufactured by Isocom Components 2004 LTD. It features a phototransistor output with an accessible base terminal, housed in a 6-pin SMD Gull Wing package. The device provides electrical isolation with a rated voltage of 5300Vrms. Key electrical parameters include a maximum forward voltage of 1.65V and a maximum input current of 60 mA. The component supports DC input signals and operates within standard industrial temperature ranges.

Feature Summary

• Integrates a phototransistor output with a dedicated base pin for external circuit control
• Provides high-voltage electrical isolation between input and output circuits
• Designed for surface-mount assembly using a compact 6-lead gull wing configuration

Applications

• Signal transmission in isolated digital logic interfaces
• Gate driving for power switching devices
• Microcontroller interface isolation

Procurement Notes

Verify the specific suffix 'XSM' to confirm the 6-pin SMD gull wing package variant. Ensure the procurement documentation references the 5300Vrms isolation rating and transistor-with-base output topology. Confirm compliance with relevant safety standards such as UL or VDE if required for the end application. Cross-reference the manufacturer part number against official distributor catalogs to avoid confusion with through-hole DIP equivalents.

Selection Notes

Select this component when a phototransistor output with base access is required for custom gain or speed adjustment. The 6-pin SMD form factor suits space-constrained printed circuit board designs. Verify that the 5300Vrms isolation level meets the system's safety requirements. Consider the 60 mA maximum input current limit during driver circuit design. Ensure the operating temperature range aligns with the intended environmental conditions.

Part Context

This part belongs to the broader category of transistor-output optocouplers. It shares functional similarities with other single-channel isolators but is distinguished by its surface-mount packaging and base-access feature. The manufacturer offers various packages for similar internal architectures, allowing designers to choose between through-hole and surface-mount solutions based on assembly preferences.