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Product Detailed Parameters
- Description：NCH 2.5V DRIVE SERIES
- Series：*
- Mfr：onsemi
- Package：Bulk
- FET Type：-
- Technology：-
- Drain to Source Voltage (Vdss)：-
- Current - Continuous Drain (Id) @ 25°C：-
- Drive Voltage (Max Rds On, Min Rds On)：-
- Rds On (Max) @ Id, Vgs：-
- Vgs(th) (Max) @ Id：-
- Gate Charge (Qg) (Max) @ Vgs：-
- Vgs (Max)：-
- Input Capacitance (Ciss) (Max) @ Vds：-
- FET Feature：-
- Power Dissipation (Max)：-
- Operating Temperature：-
- Grade：-
- Qualification：-
- Mounting Type：-
- Supplier Device Package：-
- Package / Case：-
Download product information
Overview
The onsemi CPH3437-TL-E is an N-channel MOSFET designed for RF applications. It features a surface-mount CPH package with six pins and dimensions of 2.9mm length by 0.9mm height. The device supports a drain-source voltage (Vds) of 25V and operates within a temperature range of -55°C to +150°C. Maximum power dissipation is rated at 400mW, with a gate drive series specification of 2.5V.
Feature Summary
- N-channel MOSFET configuration optimized for radio frequency signal processing
- Compact surface-mount CPH package suitable for space-constrained designs
- High thermal stability supporting operation up to 150°C
Applications
- RF signal amplification circuits
- Wireless communication transceivers
- Radio frequency switching modules
Procurement Notes
Verify the specific datasheet revision and electrical characteristics directly from onsemi documentation before integration. Confirm that the CPH package footprint matches the target PCB layout. Ensure thermal management strategies align with the 400mW power dissipation rating under expected operating conditions.
Selection Notes
Select this component for RF designs requiring an N-channel MOSFET with a 25V breakdown voltage. The 2.5V drive series specification indicates compatibility with low-voltage logic interfaces. Consider the small CPH package size when evaluating board space constraints and assembly capabilities.
Part Context
This part belongs to onsemi's discrete semiconductor portfolio, specifically within the RF transistor category. It complements other high-frequency components used in modern wireless infrastructure and consumer electronics. The CPH packaging standardizes mounting for compact RF modules.
Replacement Considerations
Publicly confirmed substitute part numbers are not available in the provided source material. Verify pinout compatibility and electrical parameters against potential alternatives using official manufacturer cross-reference tools.
