DDB6U205N16LHOSA1

Description：DIODE MODULE GP 1600V MODULE
Series：-

SKU:c49d585a89a6 Category: Diode Arrays Brand: Infineon Technologies

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Product introduction

DDB6U205N16LHOSA1 is listed in the Diode Arrays range at ChipApex. The manufacturer field lists Infineon Technologies. Its product description is DIODE MODULE GP 1600V MODULE. Review the specifications below when checking this part for your BOM.

Diode Arrays specifications for DDB6U205N16LHOSA1

Description：DIODE MODULE GP 1600V MODULE
Series：-
Mfr：Infineon Technologies
Package：Tray
Diode Configuration：3 Independent
Technology：Standard
Voltage - DC Reverse (Vr) (Max)：1600 V
Current - Average Rectified (Io) (per Diode)：-
Voltage - Forward (Vf) (Max) @ If：1.47 V @ 200 A
Speed：-
Reverse Recovery Time (trr)：-
Current - Reverse Leakage @ Vr：10 mA @ 1600 V
Operating Temperature - Junction：-40°C ~ 150°C
Mounting Type：Chassis Mount
Package / Case：Module
Supplier Device Package：Module
Grade：-
Qualification：-

Diode Arrays datasheet and documents for DDB6U205N16LHOSA1

DDB6U205N16LHOSA1

Diode Arrays Overview

The Infineon DDB6U205N16LHOSA1 is a three-phase rectifier diode module in the ISOPACK NB 6 package. It features a repetitive peak reverse voltage of 1600 V and an output current of 205 A at TC = 100°C. The maximum forward voltage is 1.47 V at TJ = TJ max and IF = 200 A, with a threshold voltage of 0.75 V. Surge forward current reaches 1600 A for 10 ms. Thermal resistance from junction to case is 0.098 °C/W per module. The maximum junction temperature is 150 °C, and insulation test voltage is 3.0 kV RMS.

Diode Arrays Feature Summary

Integrated internal Al2O3 insulation for enhanced electrical isolation
Glass-passivated silicon pellets with soldered contacts for robust mechanical stability
High surge current capability supporting demanding transient loads

Diode Arrays Applications

Industrial motor drives
Power supply units
Inverter systems

Diode Arrays Procurement Notes

Verify component authenticity by cross-referencing the part number against official Infineon documentation. Confirm that the physical marking on the device matches the datasheet specifications. Ensure compliance with RoHS directives and check material content sheets for specific substance declarations required by your manufacturing standards.

Diode Arrays Selection Notes

Evaluate thermal management requirements based on the specified junction-to-case thermal resistance. Consider the operating ambient temperature when selecting appropriate heatsinks such as KM 11 or KM 33 series. Verify that the mounting torque specifications are strictly adhered to during installation to maintain reliable electrical connections and prevent mechanical failure.

Diode Arrays Part Context

This component belongs to the DD B6U 205 N 16 series within the ISOPACK NB 6 family. It is designed for high-power applications requiring efficient three-phase rectification. The module utilizes advanced silicon technology to deliver high reliability and performance in industrial environments.

Diode Arrays Replacement Considerations

Consult official replacement lists for compatible modules within the same power rating and voltage class. Ensure any substitute maintains identical pinout configurations and thermal characteristics to guarantee seamless integration without redesigning the cooling system.