DDTC113ZCA-TP-HF

Overview

The DDTC113ZCA-TP-HF is an NPN digital transistor manufactured by Micro Commercial Components (MCC). It features built-in biasing resistors within a SOT-23 package. The device supports a maximum supply voltage of 50 V and a collector current of 500 mA, with a power dissipation rating of 250 mW. Electrical characteristics include a DC current gain of at least 70, a transition frequency of 250 MHz, and an input resistance of 1 kΩ. The internal structure utilizes epitaxial planar die construction.

Feature Summary

• Built-in biasing resistors simplify circuit design
• Epitaxial planar die construction for reliability
• Halogen-free green device compliant with environmental standards

Applications

• General-purpose switching applications
• Driver circuits for logic interfaces
• Inverter circuits in consumer electronics

Procurement Notes

Verify the authenticity of the component through authorized MCC distributors to avoid counterfeit parts. Confirm that the ordering suffix matches the required RoHS compliance and halogen-free specifications. Ensure the tape and reel packaging quantity aligns with production requirements before finalizing orders.

Selection Notes

Select this component when an NPN digital transistor with high collector current capability is required. The integrated resistor network reduces external component count. Verify that the operating temperature range and power dissipation limits meet the specific application thermal constraints.

Part Context

This part belongs to the DTC113 series of pre-biased transistors from Micro Commercial Components. It is designed as a replacement for discrete resistor-transistor networks, offering space savings on printed circuit boards. The SOT-23 package provides a compact footprint suitable for surface mount technology assembly processes.

Replacement Considerations

Check pinout compatibility and electrical ratings against existing designs. Verify that the replacement part meets the same voltage and current specifications. Ensure the new component's package dimensions fit the available board space without mechanical interference.